Electronics Forum | Wed Sep 07 00:28:04 EDT 2011 | woodsmt
I have identified a Board design issue and having trouble convincing others of my findings. I have a BGA (Sn63 balls, +1500 IO, 0.6mm ball, 1mm pitch, with heat spreader plate)that has a high incidence of solder shorting on the corners. The board i
Electronics Forum | Thu Apr 02 21:25:16 EDT 2009 | davef
On Orbel E-Z SHIELD, Surface mount two-piece fence and cover: Make the pads 1:1 with the pads on the fence. On Autosplice MINI 7-V2004-115 RFI Clip floating: * Autosplice recommended pad small dimension is very close to the small dimension of the pa
Electronics Forum | Fri Jan 11 06:38:58 EST 2019 | tirthkar8980
what is the standard for pad size of SMD chip type components
Electronics Forum | Thu Jul 22 15:35:43 EDT 2004 | C.W
have you searched thru the component spec.? the component manufacturer should have the foot print guide line.
Electronics Forum | Sat Jan 12 01:25:53 EST 2019 | tirthkar8980
Respected sir, thank you so for useful information. Thank you, Tirthkar
Electronics Forum | Fri Jan 11 14:45:03 EST 2019 | davef
Here's a presentation on IPC-7351C [ http://www.ocipcdc.org/archive/What_is_New_in_IPC-7351C_03_11_2015.pdf ] by Tom Hausherr, CEO & Founder of PCB Libraries, Inc. PCB Libraries helps support SMTnet.com
Electronics Forum | Thu Jul 22 12:02:52 EDT 2004 | lloyd
I'm currently having issues with a 28 terminal MLP package. I have only recently started in a new company and it seems as though the manufacturers guide lines as to pad geometry do not work (at least for us). So I now have a situation where I have 4
Electronics Forum | Sat Jul 24 09:06:40 EDT 2004 | davef
We believe that many manufacturers' recommended pads should be close to the last resort. Recommendations are: * Standardize with the IPC guidelines or those by Jim Blankenhorn [ smtplus.com ]. Anyone that wants to change from that standard needs to
Electronics Forum | Mon Apr 05 14:57:59 EDT 1999 | Alvaro Carrillo
Hi, Somebody know how to calculate the size of pads for different IC's: QFP's, SOIC, SOJ, etc. any help is apreciated. thanks AC
Electronics Forum | Wed Jul 09 10:15:57 EDT 2008 | aj
I have carried out some further measurements on the device and the results are as follow: Component Lead width measures 183 microns. Actuals PAD width measures 158 microns. What I am thinking is that the lead is attracting the solder hence prevent
