Electronics Forum | Mon Feb 13 01:47:28 EST 2017 | soldertraining
Solder flux and solder paste deposition is a standard step during the chip attach and sphere attach portions of BGA and CSP assembly. A technique called ultra-violet fluorescence intensity mapping (UV FIM) has been introduced that allows flux measure
Electronics Forum | Mon Nov 12 10:59:24 EST 2007 | chineechooze
i got graph and proces mapping for dah ROhs
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