Electronics Forum | Thu Mar 18 23:09:27 EDT 2021 | cbeneat
We use X-Ray for partials. It's at our other plant, but as far as I know they have no issues with count, quick too.
Electronics Forum | Fri Mar 19 12:51:11 EDT 2021 | lhd_qa
Thanks for the insight, we will have to look more in to them.
Electronics Forum | Tue Mar 30 12:19:11 EDT 2021 | chicagoindustrial
+1 for x-ray. It's the only way to go.
Electronics Forum | Thu Mar 18 19:53:29 EDT 2021 | lhd_qa
Hello everyone. I am new to the forum so I am sorry if this has been asked before. Does anyone have any suggestions for counting partial reels and cut tape? We are a distributor and for our ecommerce PDC we keep having quantity issues. Currently, we
Electronics Forum | Sat Mar 20 00:14:54 EDT 2021 | cbeneat
This is the model we have. The x-ray parts counter is from Optical Control and is a model OC-SCAN CCX.3 A.
Electronics Forum | Wed Mar 12 12:28:52 EDT 2008 | operator
I recently witnessed a process in which the solder pot operator used Techspray WSOL water soluble masking to cover the areas around a connector that was to be soldered on the solder pot. He did not wait for the WSOL to cure. He soldered immediately.
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Fri Mar 14 11:18:29 EDT 2008 | operator
The way it works is the liquid solder immediatley cures (or should I say burns) the WSOL where ever it touches it. This hardens and keeps it in place and protects whatever is under it. Some of the WSOL falls of in the pot. I am suprised that the burn
Electronics Forum | Thu Nov 01 10:57:34 EDT 2012 | kris1128
Has anyone heard whether the elevation of a plant can effect solder joint formation? One plant at sea level, one at 7,000 feet elevation... same equipment and profiles, big voiding defects at higher elevation. I did a search and found no similar post
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
