Electronics Forum: parts getting damaged (Page 12 of 350)

Can I use lead free BGA parts in a lead based process?

Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant

Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't

Can I use lead free BGA parts in a lead based process?

Electronics Forum | Wed Jun 16 11:38:50 EDT 2004 | russ

Am I getting confused here? What about the the CBGA packages that we have been doing for 5-6 yrs? We never reflowed those balls since we couldn't due to the alloy. I have been informed that if you increase paste volume to ensure a full fillet aroun

Screen Printer Help - 100MV UP100 or Quad 100MV

Electronics Forum | Thu Mar 04 15:11:45 EST 2021 | mendez

Thats good to hear. I have (1) extra boards for the LCD and the Motion drivers in case something gets damaged later because as you mentioned; parts are very difficult to find (or super expensive) I did soldered the IC chip on the LCD unit and get RE

Component sticks to cover tape

Electronics Forum | Fri May 20 09:13:58 EDT 2011 | ck_the_flip

We have issues with the Philipps Luxeon Rebel LED where the part sticks to the cover tape during advancement. This causes the part to get flopped around in the pocket or the component gets dropped and damaged when the feeder advances. Has anyone ex

MyData A12 tool tip damage

Electronics Forum | Wed Jun 06 13:33:18 EDT 2012 | upguy

As in a previous thread, we have the A12 tool tip on our TP9-UFP get sliced/damaged at random times while picking parts. Sometimes it doesn't happen for several weeks, but sometimes twice in a day. There are enough locations for the magazines neede

AOI MACHINE QUERY

Electronics Forum | Mon Mar 07 16:15:38 EST 2022 | astarotf

Hello I am looking for positive and negative feedback on this VISCOM S3088 BASIC AOI machine. If anyone has had the opportunity to work with this machine in the field of visual inspection of electronic boards, to ensure proper SMT assembly, and knows

Anyone facing QFN package crack problem ?

Electronics Forum | Thu Nov 29 16:00:03 EST 2007 | jmelson

Desoldering often applies a LOT more heat and thermal stress to the part, and maybe mechanical forces while everything is hot, to get the part free of the board. So, a lot of damage might be done there, making post-mortem harder. Without the leads,

Alternative to Stick Feeder and Vibratory for SOIC-8

Electronics Forum | Mon Jan 31 15:02:52 EST 2005 | gs

First of all ask your Suplliers to provide you SMD in Tape & reel, second point, you can ask Service for Tape & Reel or in case components are not so many, you could asses ef convenient to buy a sinple maual Tape & Ree machine and do it inside your f

Selective BGA ball removal

Electronics Forum | Fri Nov 07 16:00:45 EST 2003 | Don A

It would depend on how many boards and parts you need to build. I would prefer an etch cut as it leaves the the part intact and you get the strength of the solder joint. It also reduces the handling of the BGA and associated damage from that

Inner Layer Separation from Barrel Wall - Too Much Heat?

Electronics Forum | Sun Nov 20 04:40:12 EST 2005 | KEN

I agree with Davef. If no evidence of gouging or pad damage exists thn I would suspect supplier issue. An easy test would be to load the hole with part and thermocouple and find out what your irons are capable of delivering. Unless you're solderin


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