Electronics Forum | Tue Jan 16 07:02:47 EST 2001 | You Kim Huat
HI, Can someone advice me, is there any guideline to determince the opening for stencil during stencil fabrication. Also is there any method to determince whether the solder paste amount is enough during this process.
Electronics Forum | Tue Jan 16 07:07:03 EST 2001 | You Kim Huat
HI, Can someone advice me, is there any guideline to determince the opening for stencil during stencil fabrication. Also is there any method to determince whether the solder paste amount is enough during this process.
Electronics Forum | Tue Mar 06 03:29:05 EST 2001 | daled
Hello I am looking for any data that confirms the long term reliabilty of no clean paste as opposed to water soluable. Does anyone have any past experiences of problems when changing over from water soluable to no clean in the SMT prcocess?? Thanks i
Electronics Forum | Thu Apr 05 16:57:58 EDT 2001 | Jerry
Hi Dave, If my solder paste is RMA based and my Wave Solder flux is NC Based, will there be incompatibility problem that might arise during the process? thanks
Electronics Forum | Thu Apr 05 17:00:43 EDT 2001 | Jerry
Hi Dave, If my solder paste is RMA based and my Wave Solder flux is NC Based, will there be incompatibility problem that might arise during the process? And if i don't clean my boards what will be the possible effects of the residues left? thanks
Electronics Forum | Wed Apr 11 19:32:39 EDT 2001 | Adam
I'm trying to find information/articles describing the effects of temp and humidity on solder paste. Just recently we have gone through a change outside temperature and humdidty and have notice solderabilty problems with smt boards.
Electronics Forum | Tue Apr 17 10:22:16 EDT 2001 | tom g
Has anyone out there had solder joint wetting issues with Murata ceramic chip caps, in particular with Alpha UP78 no-clean paste? We are finding that changing either the paste or the vendor corrects this problem. If so, please advise your solution(
Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef
Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes
Electronics Forum | Thu Aug 24 13:21:57 EDT 2000 | Dave F
Please compare indium (In) / Tin (Sn) paste properties in terms of reflow profile, creep, grain structure, etc with other major no-lead solder formulations.
Electronics Forum | Wed Aug 23 12:11:05 EDT 2000 | Dave F
Dr. Lee: What are the issues around dispensing solder paste on 20 pitch SMT device pads?
