Electronics Forum | Wed Jan 30 09:41:36 EST 2013 | eniac
I think, the target is one - restore the properties of solder paste. Fluxing properties, adhesive ability is main.
Electronics Forum | Wed Dec 05 11:11:30 EST 2012 | eniac
SAC305 - it's just a metal composition of solder paste. All properties of solder paste depend on chemical composition of flux and other components - I don't know their names in English, sorry.
Electronics Forum | Mon May 17 02:06:57 EDT 2004 | johnwnz
Look here: _a class=roll > href="http://www.aimsolder.com/techarticles/tech%2 > 0sheet%20BGA%20voiding-%20reducing%20through%20pro > cess%20optimization.pdf" > target="_blank"_http://www.aimsolder.com/techartic > les/tech%20sheet%20BGA%20voidin
Electronics Forum | Wed Jan 30 15:10:09 EST 2013 | hegemon
Restoration of the fluxing properties? Can't see adding a liquid flux to a solder paste (assumed expired shelf life) in order to "restore" anything. If the volatiles in the original paste are gone, then adding more carriers and volatiles will not pr
Electronics Forum | Thu Jul 20 13:01:07 EDT 2000 | qsheng
What is the difference of formulation No-Clean Sn63 with No-Clean lead free paste? Is there techniocal data in detail for performance property of No-Clean lead free paste (for example, viscosity, solderability, tack, print life, reflow profile)? Is
Electronics Forum | Sun Oct 31 11:01:06 EDT 2010 | cobar
Alloy properties http://www.shanelo.co.za/Alloy%20Properties.htm
Electronics Forum | Mon Dec 22 14:15:41 EST 2008 | ck_the_flip
As Emil says, it's 100% the glue! Your paste is not designed to hold parts on at wave solder. Reflow is MUCH hotter than glue, so I doubt you're not adequately heat-curing it. Possibly, the glue cure is "too hot" and maybe making the material brit
Electronics Forum | Sat Nov 03 11:20:35 EDT 2012 | davef
EricR: There's substantial information about the properties of solder alloys on the web. Here's an example of something that I clipped from one site Alloy ||Solidus (°C)||Liquidus (C°) ||Tensile Strength (psi / MPa) Sn42 Bi58||-E-||138||8000 / 55.2
Electronics Forum | Thu Oct 26 17:53:32 EDT 2000 | Dave F
John: I�m here. On "what do ya think about that one!..."??? Mutha, that sounds rat�s rump [as Dennis Miller says] ugly. On some boards, we paste a cuppla chips on the break-away panels and then torque the chips from the board after cure. We use the
Electronics Forum | Fri Feb 09 02:30:50 EST 2007 | Muhammad Haris
What are Resins, Solvents, Activators, and Thickening Agents in Solder Paste and what are their helpful and harmful effects? AND What are the purposes/properties and effects of Sn(Tin), Pb(Lead), Ag(Silver), Bi(Bismuth), In(Indium), Cu(Copper), Ni(
