Electronics Forum: pcb assembly optimization (Page 9 of 170)

Clean vs No Clean PCB assembly process

Electronics Forum | Thu Jul 26 13:49:48 EDT 2001 | johnmaetta

That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th

Clean vs No Clean PCB assembly process

Electronics Forum | Thu Jul 26 14:06:46 EDT 2001 | johnmaetta

That's a good question. On some of the assemblies that our engineers test, appear to have been reworked in these suspect locations. I have requested rework data from our CM by providing them with assembly and serial numbers. Their data shows that th

Lead free parts on a leaded assembly

Electronics Forum | Thu Oct 05 15:58:16 EDT 2006 | RusH

Mario, Thanks for your response. We are building a leaded assembly with hot air leveled Sn/Pb pads on the PCB. In one case the component is a 7.5X5.2X1.8 wire wound ferrite inductor with Au/Sn leads. The second component is an 0808 Tantalum cap,

Lite-On side looking LED assembly problems

Electronics Forum | Thu May 29 14:48:45 EDT 2014 | olek

On one of our designs, we use LEDs Lite-On/LTST-S110TB (SMD). PCB footprint was designed according to manufacturer's recommendations. However, our vendor has problems with assembling these parts. Some parts are tilted, other have bad solder joints or

Clean vs No Clean PCB assembly process

Electronics Forum | Tue Jul 24 20:16:13 EDT 2001 | davef

We don't believe that water is thin enough to clean a uBGA. Given your telecom biz, what cleanliness standard do you use? How do you measure it? And how often do you check it? What are your in-bound materials cleanliness standards? [Oooo, I gues

Clean vs No Clean PCB assembly process

Electronics Forum | Wed Jul 25 10:46:36 EDT 2001 | Steve

Most of the problems that you will find with NC is visual. I have not found or heard of any real evidence that NC causes component or board failures. The residue has extremely high resistance, which actually gets higher as time goes on. It's a paradi

Clean vs No Clean PCB assembly process

Electronics Forum | Sat Jul 28 10:51:38 EDT 2001 | nifhail

I'm curious over what would happen if we continue to use the WS paste when dealing with uBGA. Definitely the cured flux under uBGA package couldn't be cleaned/reached and as I understand correctly they are corrosive. if that so, how long do you guys

Measuring PCB Stress during the assembly process

Electronics Forum | Tue Nov 27 20:32:38 EST 2001 | davef

Stress is meaningful if it affects the long term reliability in a product's end-use environment. I don�t believe that things are that straight forward, although it would be nice if they were. Consider that differences in materials, number of layers

Lite-On side looking LED assembly problems

Electronics Forum | Wed Jun 04 21:11:11 EDT 2014 | isd_jwendell

This style gave me grief as well. The problem is the way the part is manufactured leading to an unusual pad configuration. When the part is placed on the PCB there is no pad wrap under the part, the pad is 90 degrees to the board. The datasheet shows

Clean vs No Clean PCB assembly process

Electronics Forum | Tue Jul 24 19:26:20 EDT 2001 | johnmaetta

Thanks Dave. We develop high-speed telecom PCB assemblies that use uBGA and other fine pitch components. Our policy has been to use an NC process at our CM. Our engineering group, who is also a customer, and uses these assemblies for development,


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