Electronics Forum | Thu Aug 16 13:00:32 EDT 2007 | russ
Here is what you need to do if you can, Since you want to shporten the bake time you need to increase temp. weigh a board prior to your current bake process (you need very hi resolution scale for this) weigh the same board after current process a
Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon
Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Wed May 03 11:33:11 EDT 2006 | Cmiller
If you want to be able to put down every type of part, and fast, you better look at buying two machines. You did not say how much speed you need but in-line spindle machines rely on gang picks to be able to come anywhere close to rated speed. I have
Electronics Forum | Fri May 15 18:13:35 EDT 1998 | Earl Moon
| | | Does the temp. profiles used to reflow double sided pcb's through a IR oven | | on FR4 board material have to be re-established if it is changed to | | polyimide? Boards will be baked out prior to assembly. | | any response would be most appr
Electronics Forum | Mon Dec 27 13:26:47 EST 2004 | HOSS
Need some feedback here. We're running a foam fluxer using WS chemistry (AIM 715M). We have been running almost exclusively .062 and a few .093" PCBs but we've recently started running some boards that are .100 and .125 thickness and are having tro
Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson
| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin
Electronics Forum | Wed Mar 05 10:59:04 EST 2003 | jfb2003
Currently, my company's applies a PCB bake (5 hours @ 125C) for all SMT PCB's prior to surface mount assembly. Many of us believe this is a non-value added activity, and have concluded it can be eliminated. With today's PCB process controls coupled
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