Electronics Forum | Mon Jul 23 12:12:57 EDT 2001 | kennyhktan
Good day! As we all know the normal recommended solder paste(Sn62/Pb37) reflow profile time is around 40~60sec above the temperature of melting point. Now I'm setting my peak temperature at the high site of solder paste recommended spec. due to metal
Electronics Forum | Tue May 02 15:29:14 EDT 2000 | M. F. Roe
I am looking for public papers or articles on intermetallic formation as a function of reflow profile. Most solder paste vendors specify peak temperature and time above liquidus, but I am particularly interested in what happens to intermetallic grow
Electronics Forum | Wed Mar 15 09:28:30 EST 2006 | mapell
Vick I would not think what your seeing is normal. Just guessing without a profile but.... - not reaching peak temperature - not enough soak time or mild ramp to burn away the flux - shortened TAL, not allowing proper time for the solder to wet - lo
Electronics Forum | Wed Aug 16 18:25:11 EDT 2006 | jhamner
I have seen a lot of discussion recently regarding reverse spike and double spikes in the reflow profiles of ovens. This is where a zone other then the last zone is the peak temperature, or where the last 2 zones have the same setpoint. Anyone have
Electronics Forum | Thu Oct 19 08:48:32 EDT 2006 | stepheniii
Time is also a factor, usually. IIRC almost everytime I"ve seen a max temp rating it also included time. ex. 225C for 20 seconds. If a part can take 300C but the spec sheet says 220C and you take it to 225C, it doesn't matter if the heat made the pa
Electronics Forum | Thu Oct 19 09:54:38 EDT 2006 | stepheniii
Don't confuse ROHS compliant with "able to take higher temps". In fact I think some parts lost some heat tolerance when they went ROHS compliant. Don't forget that some fire retardants are on the banned list. I do know that before we even heard of R
Electronics Forum | Mon Feb 12 13:01:09 EST 2007 | campos
Hi all,, I running SMQ230 solder paste with a time above = 40sec with peak temperature = 239 degrees .. the complete reflow takes almost 6 min with a slope (150to190) close to .60 degrees/sec .. may I have some concern about that or it's ok?? tks..
Electronics Forum | Fri Aug 15 10:23:56 EDT 2008 | ck_the_flip
Ovens, and any other process for that matter, will ALWAYS vary. It's called process variation. I do Cpk (process capability) on my ovens. I track time-above-liquidus and peak temperatures. Statistics will validate how repeatable your oven is.
Electronics Forum | Sat Jul 22 11:38:18 EDT 2017 | vchauhan
We normally do reflow profile on non-populated solder sample board. We do use some critical component like BGA and put thermal couple underneath. I need your expertise. How much will it drop in peak temperature when we will be running populated board
Electronics Forum | Tue Dec 31 02:29:29 EST 2019 | sssamw
Do you have clear picture show how it looks like solder open? And you can run DOE with TAL and soak time and peak temperature to see which factor is key, or non of them is key then you can try add some flux to see if better before change solder past
