Electronics Forum | Mon Aug 09 10:27:14 EDT 1999 | Tim Murphy
Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, and/
Electronics Forum | Mon Aug 09 16:37:14 EDT 1999 | John Thorup
| Just curious what effect pinholes and solder voids can have on solder joints that have high current passing thru them. Also could moisture from steam sterilization (autoclaving) get inside a said solder joint and then outgas during high current, an
Electronics Forum | Mon Mar 27 15:10:48 EST 2006 | ms
Hi Steve Thanks for your reply. Your comments make it sound like it may be the nature of this paste. Any one else agree? Paste control is fairly good. Paste is put in fridge straight after it arrives at inwards goods, (4deg). Removed from fridge
Electronics Forum | Tue Jul 15 22:50:12 EDT 2003 | iman
We have an internal engineering study on blowhole solder joints and had helped reduce the problem to pinholes symtoms. The pinhole occurs in solder joint of a Land-Grid-Array (LGA) side-wall (external perimeter of package) fillets. Our customer is a
Electronics Forum | Wed Jul 23 06:54:06 EDT 2003 | davef
100 sec) and decrease reflow temp to 205C.
Electronics Forum | Thu Dec 12 17:39:14 EST 2019 | davef
When I hear "pinholes" in solder connections, I think of two sources, depending on the situation, which can be either: + Entrapped air and process chemicals develop during reflow soldering to cause the pinholes in and around the intermetallic layer
Electronics Forum | Wed Jul 23 05:47:53 EDT 2003 | iman
Yo Thanks! right on the money pad, the pinhole occurs mainly in the (fillet's) top-surface central of the whole solder (fillet surface) area. Like you said, large surface area, lowest surface tension. that's a possible cause, that the potential voi
Electronics Forum | Mon Jul 21 21:59:08 EDT 2003 | davef
Theory #6 [maybe 3a?]: If you change your paste to a 'non-voiding' paste, your problem will go away. It's the flux in your paste that's killing you. The flux gets trapped in the solder and then releases ejacta that form the volcanic openings in you
Electronics Forum | Tue Jul 22 02:33:36 EDT 2003 | iman
Dave F, thats' the path of thought we are now bumbling along, but no way is the paste vendor is going to admit straight out to any such affirmation. Any literature online on this possible root cause? as it helps to gain substain-able theory in ha
Electronics Forum | Wed Jul 16 21:38:27 EDT 2003 | sam
I have done a DOE on the SMT components, not the BGA, for reducing void within the solder. The result did not help in the void reduction, but confirmed that the speed of the IR oven, solder paste thickness may be the important factors for the void.
