Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Thu Sep 19 17:14:02 EDT 2002 | davef
Comments are: * Use an eraser if the surface of Au is not clean, but make sure the eraser has no/low ionics (such as sulfur that is a common additive for rubber). * If the plating surface required eraser to remove the top surface, the plasma normally
Electronics Forum | Wed Jan 09 18:17:15 EST 2002 | Chris
I don't have a plasma cleaner either. It will help a lot. Actually I don't clean at all. Our wirebond pads are far enough away so the flux residue does not get on the wirebond pads. That's what we think anyway. I am sure we have some degree of c
Electronics Forum | Wed Jan 09 17:14:48 EST 2002 | mregalia
Do you bond with Al or gold wire? What happens if the Ni is over 150 microinches? Thickness of nickel is one those things that we have not been consistent with. The industry seems to pretty much universally call for 100-200 microinches. Our old board
Electronics Forum | Fri May 14 11:17:42 EDT 2004 | Ashok Dhawan
I am having coating adhesion problem with flex circuits. The cover plate material is KAPTON or Poly imide. The conformal coating material used is humiseal 2A64. The boards are cleaned, measuring less than 4 microgram Nacl per sq in. against acceptabl
Electronics Forum | Fri Oct 13 17:21:05 EDT 2000 | Jason Nipper
A few weeks back we experienced a wave process problem where we received deposits on our pcb. At first we though it was dedrites but after an outside analysis of the deposits they were found to be tin. We have tried to remove the deposits with brus
Electronics Forum | Tue Nov 25 05:20:20 EST 2014 | grimus
Could be. I am making overprint to achieve proper amount of solder paste inside hole. Now I am trying to reduce maximum overprint and compensate it with step - up stencil. This could reduce effect that some particles of solder paste are not gathering
Electronics Forum | Tue Oct 05 04:23:38 EDT 1999 | Brian
| | | | Can someone suggest what material I have to use to protect components by electrical discharge on ptfe based boards? | | | | It should have high resistivity, thermal stability (-40 +70 'C),perfect adherence on ptfe... | | | | Many tahnks | |
