Electronics Forum | Wed Sep 22 09:25:42 EDT 1999 | Wolfgang Busko
| | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the scree
Electronics Forum | Wed Sep 22 10:03:07 EDT 1999 | Boca
| | | | i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the s
Electronics Forum | Thu Nov 09 23:27:53 EST 2000 | Craig
We are considering using gold plating on our fine pitch pcbs (as oppossed to HASL). We have heard of long term solder reliability problems with joint imbrittlment how bad is this and does it apply for all of the different plating processes the same?
Electronics Forum | Tue Feb 23 16:39:58 EST 2021 | SMTA-64386114
We are looking to barcode our pcbs for industry 4.0 traceability. We have a fairly new laser that we use for other operations like case marking and would like to use this to mark a 2D barcode on the PCB surface for the SMT equipment to be able to s
Electronics Forum | Wed Feb 24 22:53:32 EST 2021 | solderingpro
Panasonic has a great training facility in Kentucky that could be of enormous benefit to you and your team. Materials and Lasers range in capability. Generally speaking you need good contrast; which is not always guaranteed with bare PCBs. As othe
Electronics Forum | Wed Sep 22 08:26:53 EDT 1999 | g cronin
i'm sure everyone has run into this at one point or another. I have a thin pcb .025 that is single up that has to be built on a pallet. does anyone have any tricks to the pallet design that will help to hold these boards down during the screen/ass
Electronics Forum | Wed Dec 13 10:24:52 EST 2000 | Wolfgang Busko
Hi Jack, I once tried this finish ( without changing any process parameters ) and encountered wetting problems even in the first reflow process. It was thought as cheaper alternative to Ni/Au we use for planarity reasons. Heard of the same problems
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F
In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob
Electronics Forum | Thu Sep 23 17:31:12 EDT 1999 | DaveH
For another excellent vendor try EMC GlobalTechnologies in Pennsylvania (215)340-0650. Contact Marty Wetzel. | | | | | | any thoughs? | | | | | | thanks | | | | | | | | You should use pallets that stand the reflow as well so that no separation wi
