Electronics Forum: profiler (Page 245 of 462)

problem in solderability

Electronics Forum | Thu Sep 04 07:41:35 EDT 2008 | scottp

I happen to agree with Vlad and I'm not in the same business as him. Randomly turning knobs isn't the way to solve a problem. Do a proper analysis and let the parts tell you what's happening. Seems like a lot of problems people post on this forum

soldering ROHS boards with sn/pb components

Electronics Forum | Wed Aug 27 09:30:22 EDT 2008 | vladig

Hi Eyal, Sure you can do that. You might be able to use your "typical" reflow profile for eutectic, or tweak it slightly. it's a good idea to do a trial run and then get a couple of components cross-sectioned and checked for the microstructure of th

BGA replacement process

Electronics Forum | Tue Sep 09 16:04:25 EDT 2008 | allan99

I don't think so if your process is a just in time rework, you have just to develop a profile at your rework station for each component and also clean the place (board) properly. If your process is not a JIT rework, you must have to bake the boards,

Best compromise

Electronics Forum | Mon Sep 08 13:44:19 EDT 2008 | davef

Try: * IPC-7530, Guidelines for Temperature Profiling for Mass Soldering (Reflow and Wave) http://portal.ipc.org/Purchase/ProductDetail.aspx?Product_code=3f5288fc-b386-db11-a4eb-005056875b22 * http://www.smtinfo.net/Db/_Reflow%20Soldering.html

Uncoalesced solder problem in fine pitch IC pads

Electronics Forum | Thu Sep 11 10:51:56 EDT 2008 | slthomas

ISSG, I didn't see you mention anything with respect to profiling. Should we assume that you've already ruled out any thermal issues? Based on the proximity of your problems to a big honkin' connector that's where I'd have looked first. But then a

SMT LEDS SOLDERING

Electronics Forum | Tue Sep 09 07:03:56 EDT 2008 | mun4o

Hi All, we poduce diferent kind of Keyboards, and use a lot of SMT LEDs.When I looking for reflow soldering Conditions i n the Data Sheets, usually I find "IR-reflow" Soldering profile.Our Reflow owen have onli conventional heating.Is that problem?

SAC305 Lead Frame Component with Leaded Process?

Electronics Forum | Tue Sep 16 09:25:49 EDT 2008 | trynders

I had a vendor change thier lead finish from tin/lead to a SAC305. We built up several assemblies before we realized the change. The reflow process is a standard leaded profile peaking at 220 C. What are the reliablity concerns with mixing the tin/l

BGA thermal reflowing issue

Electronics Forum | Fri Sep 26 07:26:33 EDT 2008 | realchunks

Looks like lack of wetting. What is the BGA ball material? Could be high temp. Could be improper profile. Could be paste sat on board too long / flux dryout. Could be co-plane mount and this ball touched at the end of reflow curve. Could be cont

Delamination / Measling

Electronics Forum | Mon Dec 08 11:46:09 EST 2008 | mleber

We are experiencing delamination / measling on card we have been running for years. No change in process. Same equipment, profiles etc. The weird thing is we are experiencing it on pwbs from different mfgs and different processes (reflow, wave, selec

BGA, ERSA, Why tem goes 300'c by itself when power on.

Electronics Forum | Mon Dec 15 09:48:53 EST 2008 | luke555

i am using ersa ir500a. my lab room's power is very low. it always shutting down by itself. My question is, after power on, the tem go to 300'c and stay there without runing profile. any one can help me please.


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