Electronics Forum | Fri Apr 24 06:16:50 EDT 2009 | naguiar
CHANGE SOLDER PASTE, AND ADJUST PROFILES. Nolasco
Electronics Forum | Tue Oct 23 08:07:44 EDT 2012 | kkay
I have attached a PDF overview of some test we have done and the results. (fixed oven profile)
Electronics Forum | Tue Jan 14 13:28:44 EST 2020 | cyber_wolf
Your profile looks textbook.
Electronics Forum | Fri Jan 17 02:49:11 EST 2020 | jakapratama
Yeah, that's a nearly uniformed ramp up profile, I can't see anything's wrong with that.
Electronics Forum | Mon Dec 13 14:57:41 EST 2004 | DasonC
I run a D.O.E. and print different water soluble pastes on the same board by mini-stencil and reflow on same profile. WS709 is one of them but Indium6.2 shown less and no void then WS709. P.S.: profile may affect the result. Do U have Via in pad?
Electronics Forum | Tue Feb 12 04:07:29 EST 2008 | aj
Hi, Have you checked out the BGA datasheet and see what profile is recommended for the BGA ? I use OM338 and there are dozens of recommended profiles for the Paste but you have to consider the components aswell. You state your Peak temp which I w
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Fri Feb 25 04:28:49 EST 2000 | Sze-Pei LIM
We faced terrible void issue while using Sn96.5Ag3.5 solder paste, more than 20% void. We tried adjusting the reflow oven profiles but we did not have much success in reducing the void. Generally, we find quick preheat, high peak temp. and fast cooli
Electronics Forum | Wed Oct 04 17:15:23 EDT 2006 | russ
that question I think I will punt it on over to some of the experts here. I really do not the "why". voids for me have always been related to the escape (lack of) of the "stuff" that is in the paste. I have seen diff pastes perform differently rel
Electronics Forum | Fri Jul 08 15:19:56 EDT 2011 | markhoch
Your images are depicting signs of voiding. Some voiding is common. In an assembly like this, I would concentrate on minimizing the voiding as much as possible, and then using that as your baseline. I'd then treat the voiding as a process indicator.
