Electronics Forum | Fri Aug 20 13:00:16 EDT 1999 | ScottM
| I'm trying a second time to post this very important message, to me, concerning Air-Vac's following creation. Does any own and use this stuff successfully to remove solder from 20 layer and up MLB's with .020" diameter holes? Also, is any of the ad
Electronics Forum | Fri Jul 23 10:16:16 EDT 1999 | Boca
| | | Dear all | | | Please help me to know what kind of tests usually done after SMT Pick & place and reflow oven. | | | Our appliocation is Mainly fabrication of mother boards. | | | Thanks | | | | | In theory, ICT is the classical answer (In-Ci
Electronics Forum | Sun Apr 25 04:34:09 EDT 1999 | Earl Moon
No this message isn't about my triumphant return. It's not even about that lady I wanted to run away with to Mehico (who were you again). It's about progress and some of you might be interested, or not. 1) For DEKheads, I submit we had two of Britai
Electronics Forum | Sun Apr 25 04:12:34 EDT 1999 | Earl Moon
| At Sanders (Military manufacturer), we have only started using plastic parts within the past few years. After being tasked with reviewing the new J-Std-033, it became obvious to me our process for controlling device exposure is weak. We build very
Electronics Forum | Mon Mar 08 23:43:54 EST 1999 | Dean
> Alignment issues are not so critical on most any system, but thermal >>(top and bottom heater settings) certainly are. Without a serious >>system, I just don't see how it can be done. | | | | Thanks again Earl for your valuable communications..
Electronics Forum | Wed Feb 17 15:56:22 EST 1999 | Tuffty
| Dear Al, | Are these reworked, double-sided boards? | | If you attempt to clean side #2 of double-sided misprint in a "spray" type cleaner, millions of solder balls can be broadcast throughout the same chamber as the populated side #1. Or, if thi
Electronics Forum | Tue Nov 17 09:24:24 EST 1998 | Earl Moon
| | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave solder
Electronics Forum | Wed Nov 18 21:58:17 EST 1998 | Dave F
| | | For some as yet unkown reason, we have started to have some boards sag and go under the wave. The boards are surface mount top side and conventional components wave soldered. We have checked the wave hight and both the profiles on the wave sold
Electronics Forum | Tue Oct 27 16:11:36 EST 1998 | carl m
| | | | What are the key feature to look for in buying a profiling product for Reflow ? | | | | | | Who's is the best and how much do these systems cost ? | | | | | | Thanks in advance. | | | | | | Hi Mark, | | | | I am currently the oven secto
Electronics Forum | Fri Oct 16 09:12:46 EDT 1998 | Scott Cook
Sorry folks. I'm just a naysayer here. Let's look at this BGA thing...... We've all been successfully processing down to 16 mil FP stuff for years, now--some of us down to 11 mil. Once the printing process was stabilized, paste rheologies were matur
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