Electronics Forum | Thu Mar 23 14:17:47 EST 2000 | Finepitch Services
Stuart, My suggestion is a DFM meeting (most of the process people dream about a meeting like this, and luckily, I've been to a few) with: - project manager (if there's one) - customer service rep (annual volume, lot size, product life) - smt proce
Electronics Forum | Sat Feb 12 10:33:31 EST 2000 | Francois Racine
First I'm a french people so excuse my bad english writing. I have a complete smt production line. First a screen printer DEK 240, a chip shooter PANASERT MVIIV, a multifonction machine MULTITRONIKS EP6000, a reflow oven at the end of the SMT line a
Electronics Forum | Wed Feb 09 21:37:37 EST 2000 | Dave F
Rob: Someone's out there turning over stones, eh? Roller Tinning, Rolled Solder. In printed circuit fabrication, a surface coating of tin-lead, typically 1-2 microns thick, applied to preserve solderability. Still available from some fabricators
Electronics Forum | Thu Jan 04 20:16:02 EST 2001 | Mike Konrad
Hi Cory, As a manufacturer of aqueous cleaning systems, my advise is somewhat biased, however I believe it to be accurate. We have hundreds of customers who have implemented no-clean programs. The programs have been successful when measuring the r
Electronics Forum | Thu Dec 14 20:04:36 EST 2000 | Dave F
Probably all of us are seeking more and better information to help us do our jobs better. But ... * Oftimes trade journals are so busy with adverts that the technical message gets somewhat lost. * It�s tough to get the information from trade journal
Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny
Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).
Electronics Forum | Mon Nov 06 10:29:28 EST 2000 | Dean Stadem
All of the replies have merit. Here is another one. Because the cause of the tombstoning is wetting forces that are imbalanced, and one end wets faster or more readily than the other, the 0402 lifts up on that end easily because of its low mass. Incr
Electronics Forum | Thu Oct 26 08:59:56 EDT 2000 | Antonio A. Medina
Ok guys, I need help. Here's the deal. We're getting micro solder balls under discreets on the bottomside of the board. Here's my set up... MPM screener w/vacuum plate 6 mil metal screen with 90% circular (rounded) apertures 7 mil (measured) past
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Tue Oct 10 08:51:26 EDT 2000 | John
Thanks for the responses, and I tend to agree. I would much rather go through a more structured continuous improvment process (set goals, meet them, set new goals and so on). Our company is rather small and made the jump from all through hole to mi
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