Electronics Forum | Mon Jun 29 07:08:24 EDT 2015 | jlawson
Rehm Thermal VX Series is the VW, Audi and BMW of reflow....Has features that enable best in industry process, lowest power and best N2 consumption should you run N2. Price is not cheapest on market but ROI has to be looked at in all areas not just
Electronics Forum | Fri Jan 30 04:10:10 EST 2009 | sachu_70
Hey Daniel, N2 gas provides an inert atmosphere which help to minimise oxidation, generally a concern across the reflow zone. Although N2 provides a more shiny solder joint, it is certainly more of a cosmetic issue and does not certify joint reliabil
Electronics Forum | Mon Jan 19 08:37:16 EST 2009 | lkpdsund
Hello all! We possess a speedline electrovert omniflo 7 reflow oven at my site. Last week we examined how the solder profile was affected by fan-speed and by providing the soldering process with compressed air(O2) or nitrogen(N2). We also ran the sa
Electronics Forum | Mon Apr 24 04:23:56 EDT 2006 | TA
Hello guys, I am Looking for a oven with the following specifications. Can any one suggest me the best suitable model. Thanks ========================================================== - heating length 2500mm - zone top/bottom 7 - forced convection
Electronics Forum | Mon May 13 06:38:41 EDT 2019 | relaycz
You need to give us a little more information. 1. What is the size of your panel? 2. Are there any heavy components? 3. What is the thickness of your board panel? 4. What kind of oven are you using? 5. Is it only a recent problem or ongoing one?
Electronics Forum | Fri Mar 28 00:56:50 EST 2003 | iman
we have a issue of post-reflow oven (SMT) soldering defects of blowholes and pinholes. Any suggestions or knowledge on root cause is appreciated to be share? BACKGROUND : we DI water wash and oven bake the PCB bareboards at 90deg-C for 60mins, to r
Electronics Forum | Fri Mar 16 15:52:22 EST 2001 | blnorman
We screen print epoxy adhesive, place components then run the board through our adhesive oven (2-5 min cure at 150�C). This is in addition to reflow.
Electronics Forum | Mon Oct 08 22:25:19 EDT 2001 | caldon
See PeteC under the recent forum entry on "Reflow Ovens"....Pete is a true wealth of knowledge. I will try to post his info at a later date. Cal Manncorp
Electronics Forum | Wed Feb 02 13:05:51 EST 2005 | russ
Process flow 1.Remove part - It may be necessary to bake assembly prior to removing. 2.Remove remaining solder from part 3.Apply flux to part 4.Apply solder spheres to part 5.Reflow part You may want to bake component before re-installing 6.Apply
Electronics Forum | Fri Apr 19 09:41:45 EDT 2002 | angiewest
We have been building BGA's for a couple of years. We even use a Universal Omni 4766 to place them with. Reflowing is where I thought we may have problems, Since we have an IR oven. But we bought a .010" thermocouple from Omega to measure the BGA
.gif)
