Electronics Forum | Fri Feb 13 08:54:43 EST 1998 | justin medernach
| Hi , | I have not been able to find any good description on how to perform double sided reflow on PCBs.The best would of course be to avoid reflowing the bottom side again but in real life this is not possible. | So when double sided reflow sol
Electronics Forum | Tue Aug 26 07:39:54 EDT 2008 | evtimov
thanks. i was looking at the silicon horizon > controller for the toaster. just to help keep the > temp constant since i can not watch it all night! this way of baking is good just for small quantities. If you want to built a lot of boards, you b
Electronics Forum | Wed Sep 22 14:22:54 EDT 2021 | oclsc
Hi Forum. Is there anyone who can tell if an empty PCB with no SMD components mounted and HAL surface will get a less solderability after been running through reflow (convection). Eg. when testing empty PCB with temperture data logger. Regards Ole
Electronics Forum | Wed May 31 16:09:14 EDT 2006 | barryg
Did You verify operation of the oscillaators(resonaters) by heating and cooling and looking at the waveforms and frequencies when doing so. We have problems when they are not packed correcttly from vendors , and sometimes they can get crackes in them
Electronics Forum | Wed Jan 03 10:41:47 EST 2007 | Rob
Consider this: The inner balls will be at a lower temperture than the outer balls in reflow, so if you cannot inpsect them then that may be where your problem lies. Are you reworking with a specialist machine that is directing the right amount of h
Electronics Forum | Thu Sep 23 10:34:54 EDT 2021 | oclsc
Hi Evtimov Thank you for a quick reply for my question :-) The reason why I am using an empty board is only to have a place for the temperture logger beside the fully mounted SMD board that is monitoring the reflow-profil and also to get the same co
Electronics Forum | Thu Feb 21 14:34:29 EST 2013 | danburnikel
I have a product that is ramping up to volumes higher that our batch oven can handle. One option is to apply Loctite E-30CL on to our circuit card and send it through a heller 8 zone oven. Was thinking of a oven temperture of 150C for about 10 minu
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Electronics Forum | Thu Aug 16 10:49:35 EDT 2001 | JohnW
Dave, we try and keep the temperture that a BGA is exposed to at wave solder below 150 deg C. At this temperature it's unlikely that you'll get near to starting secondary reflow of the device or that you'll grow any significant amount of intermetall
Electronics Forum | Thu Mar 07 19:19:41 EST 2002 | dason_c
Ron, you need to check all the thermal couples are in good shape and clean before ask the outside service to do the calibration. After the machine calibrated and I suggest that you run 2 profiles and all the heating zone set at the same temperture,
