Electronics Forum | Tue Jul 02 07:11:31 EDT 2002 | davef
There is nothing inherently wrong with voids in solder connections. They: * Do indicate that the reflow soldering process is not well controlled. * Can comprise the strength of the solder connection. Look here: http://www.smtinfocus.com/smt_failure
Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Sat Sep 12 14:10:38 EDT 2009 | GSx
First, make sure that 63/37 BGA can withstand higher reflow temperature of of lead free SAC305 GSx
Electronics Forum | Sat Sep 12 10:12:20 EDT 2009 | tylaburg
My customer wants an SnPb 63/37 BGA soldered using SAC305 solder paste. What data is avaiable showing the long term reliability of the intermetallics of the solder joints?
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
Electronics Forum | Thu Oct 19 12:34:36 EDT 2000 | lwatson
I can't seem to find an article about the limiting mass of a SMT component on the solderside of a double-sided reflowed PCB. I'm pretty sure that Phil Zarrow did an article on this subject. It went something like the mass/land surface area?
Electronics Forum | Thu Oct 19 16:10:44 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Thu Oct 19 16:10:48 EDT 2000 | John Thorup
Much has been said on this subject. Try a search of the archives for the terms "Phil Zarrow" and "surface tension". You'll likely find what you need.
Electronics Forum | Wed Feb 10 07:50:52 EST 1999 | michele sommaruga
I am referring to reflowing twice. Fist time I reflow the up side, turn the PCB and reflow the bottom side. | By double reflow are you referring to double sided reflow? Or are you referring to reflowing twice? | | | | I would like to have informat
Electronics Forum | Tue Feb 09 13:07:00 EST 1999 | ETS - Brian Stumm
By double reflow are you referring to double sided reflow? Or are you referring to reflowing twice? | I would like to have information about the processability of different packages. | In particular I would like to known for which package I can use
