Electronics Forum | Thu Jan 31 11:09:38 EST 2013 | emeto
Hello folks, we would in certain cases run a PCB second time through reflow. I never trusted a board that is reflowed multiple times and I wonder am I really right? Can we reflow boards multiple times? What are the limits? Does it depend on the PCB
Electronics Forum | Fri Feb 01 14:49:52 EST 2013 | emeto
Thank you guys. You keep adding valuable information here. I think we will try to stick with the 3 times reflow(if we count the BGA repair as 2 reflows). However sometimes we will run the board second time through the oven(just flux the suspect part
Electronics Forum | Fri Feb 01 17:53:19 EST 2013 | hegemon
In agreement with Evtimov. Max 5 reflow cycles. Something like this scenario: Build bottomeside 1 Build topside 2 Reflow topside for suspect opens beneath BGA 3 Remove BGA during rework 4 Replace BGA during rework 5 Any convective rework after that,
Electronics Forum | Thu Aug 26 22:44:40 EDT 2004 | Indy
We do perform multiple reflow only for reliability testing. 90% of the time we have not seen any change in the solder joint and no change in electricals. If you do see failure you might want to see the solderability of the surface finish too.. jus
Electronics Forum | Thu Jan 31 13:02:01 EST 2013 | dontfeedphils
Are you talking about double sided reflow or just multiple passes for one side? If you're running multiple passes for one side, why?
Electronics Forum | Fri Feb 01 22:29:16 EST 2013 | isd_jwendell
From some previous article I read (sorry, don't have citation), I think the main reason for limiting reflow count was due to via integrity.
Electronics Forum | Fri Aug 27 13:07:44 EDT 2004 | C Lampron
Hello, I believe that the area's of concern are primarily component related. Some component are rated for a temp (usually 260 degrees max) for some length of time. Tant Caps come to mind as being heat sensitive. The other concern would be the inerme
Electronics Forum | Tue Aug 24 14:49:21 EDT 2004 | Rush Fan
I was notified that one of our operators took it upon themselves to run a board assembly through our reflow oven multiple times when he discovered what looked like incomplete reflow. Based on this being done, its been asked of me how, if any, has the
Electronics Forum | Thu Jan 31 14:13:22 EST 2013 | emeto
Let's say I have an open joint on a BGA and I want just to reflux it and rerun the board.
Electronics Forum | Fri Feb 08 09:52:20 EST 2013 | emeto
Hegemon, my thinking was pretty much the same. I will probably not consider Selective soldering as a temp cycle. Thanks!
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