Electronics Forum | Mon Aug 11 09:59:40 EDT 2008 | John S.
Guys, We're seeing what looks like an issue where through hole solder joints from our ive solder process are cracking during the cooling phase of the soldering process. This was detected during thermal shock testing, and we have tracked it back to a
Electronics Forum | Thu Apr 30 14:41:46 EDT 2009 | bandjwet
There was a paper recently presented by R Cirimele at the CALCE Reliability symposium in which extensive testing was done on a part (thermal stress, vibration, shock) after numerous reballing cycles. This show no failures on the reballed parts. In t
Electronics Forum | Fri Mar 19 10:02:44 EDT 2010 | karlo
There is a wide range of BGA underfills to satisfy specific needs. Some are designed for those who place a premium on high speed, high volume processing, shock or drop test perforamnce, and ease of reworkability. Others are designed for those who p
Electronics Forum | Sun Jul 12 21:07:07 EDT 2009 | padawanlinuxero
I have a problem we change a product from leaded to lead free, I was not involve in the selection of the new reed switch, but now we are having problems with the hermeticity in the switch,this occurs after is overmould and put to a 6 cycles in the th
Electronics Forum | Tue Apr 03 08:38:34 EDT 2012 | tombstonesmt
Yesterday morning wasn't the first time I noticed this condition. We remove the dross from the pot twice a day and once a week we remove the pump assembly and it still produces this type of dross. I googled this situation and some factors of this par
Electronics Forum | Mon Jun 11 17:47:54 EDT 2012 | tombstonesmt
Pete B *We do lines of soldering @ 10mm/sec *Similar solder balls were present on product after soldering. *UPDATE SOLUTION* We began using topside preheat while fluxing the board to reduce the thermal shock factor in addition to replacing the "fi
Electronics Forum | Sun Jul 14 04:39:35 EDT 2019 | alexeyzb
I have changed job and now i have some problems. Previous experience was with high volume production and not so high quality level (class 1, 2 according IPC). Now i need to produce very high quality (and very expensive) PCBAs in Low volume production
Electronics Forum | Thu Sep 03 13:49:30 EDT 1998 | Earl Moon
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Wed Sep 09 01:28:33 EDT 1998 | John Godfrey
| | I am in need of possible causes and solutions to capacitors that are failing in the field. | | Are there issues in our process that need to be | | checked? | | Some people said the problems are due to improper | | storage. Others say it is th
Electronics Forum | Mon Jun 20 10:59:18 EDT 2005 | Jason Fullerton
Extra cooling is better (Alpha recommends -3 to -7 degC/sec) for cosmetics. Less chance of s o called 'cooling lines' that look similar to 'cold' tin-lead joints. (Seems a bit steep to me - I worry about the risk of cracking ceramic caps.) Might be
