Electronics Forum: sam (Page 3 of 15)

Voiding in Underfill process

Electronics Forum | Mon Jan 21 16:02:41 EST 2008 | rayjr1491

hi dave Is there another tool besides SAM (Scanning Acoustic Microscopy)? Regards, Ray

PCB Delamination

Electronics Forum | Tue May 06 23:16:20 EDT 2008 | hhorse

Could you tell me how to detect PCB delamination issue? through cross section, SAM or others?

Wirebond issues near SM

Electronics Forum | Mon Nov 30 11:41:05 EST 2009 | sforman1

Ni is coming up through soft Au. Sam forman

Bubbles on solder joint(after conformal coating curing)

Electronics Forum | Tue Dec 01 09:24:01 EST 2009 | sforman1

40 years. no cost to you. just trying to help Sam

Barcode printing on the PCB

Electronics Forum | Sat Mar 06 10:39:34 EST 1999 | Sam Sangani

I am looking for a barcode machine/printer which will print barcode directly on printed circuit boards with non transferable white ink. This has to be done before PCB assembly. Any help will be appreciated. Please reply directly to my E-mail. S

SAM vs XRAY

Electronics Forum | Tue Feb 09 23:40:19 EST 2010 | glennster

OK Sergey, looks like no one wants to take this on. I will give it a shot and maybe others will add their 2 cents. The answer depends on what you want to inspect. X-ray inspection is based on the X-ray absorption properties of the materials in th

Cold Solder

Electronics Forum | Sat Jul 02 08:01:37 EDT 2005 | davef

Comments are: * A good looking solder ball does not necessarily mean that you have a good solder connection between the ball and the pad. We've all seen a bright and shiney solder ball on the floor, but that doesn't mean there's a good metalurgical

SAM vs XRAY

Electronics Forum | Wed Feb 10 01:53:04 EST 2010 | sparrow

Hello Glenn, thanks a lot for your response. The company I work for is launching LEDs production this year. We'll need to do a number of the environmental tests in our quality control laboratory. So the application for SAM and Xray systems is inspect

SAM vs XRAY

Electronics Forum | Wed Feb 10 08:55:14 EST 2010 | blnorman

X-ray is probably more useful in the grand scheme of things. SAM will, like Glenn said, pick up delams in components especially at internal interfaces. X-ray will only pick up a defect like this if it's perpendicular to the delam, very difficult.

Re: SOLDER BALL UNDER THE PCB AFTER REFLOW SOLDERING

Electronics Forum | Sun Oct 11 13:45:21 EDT 1998 | Vincenzo Longobardo

Dear Park Kyung Sam, your problem can be solved asking to your PCB supplier to cover all the via holes with solder mask before the HAL. Usually this is possible and doesn't produce extra cost. Vincenzo Longobardo vinlong@tin.it


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