Electronics Forum | Thu Mar 05 23:52:26 EST 1998 | Ron Costa
| Hi Ron, | Your question really opens up a "Pandora's box", but when you say you're not able to print perfectly, what is it exactly that you mean? Is the print lacking volume? Is it mis-registered? Are you bridging? Also, what printers have you used
Electronics Forum | Fri Mar 14 20:23:45 EDT 2008 | crashoveride
We do our work instructions manually..... taking pictures of actual parts and process. But I have this idea of converting the conventional printed WI's to video instructions. I am now proposing a flat screen per work stations and video will play on e
Electronics Forum | Thu Apr 26 13:37:02 EDT 2012 | bobsavenger
I was just wondering what everyone is using for a standard cleaning cycle on their screen printers? I'm sure there a study that I can do on printing but don't have the time currently. Please let me know what everyone is doing as a standard practice
Electronics Forum | Tue Feb 20 17:30:14 EST 2001 | billschreiber
Dave, I think we are heading toward the same objective, but from different directions. You are asking what's the cost of ownership? However, I think a question that is just as important and one that is pertinent to your current economic picture is,
Electronics Forum | Thu Jun 17 21:24:32 EDT 1999 | Dean
| first of all what is the technical term for the small amount of solder on a plated pad. we are getting poor screen printing gasketing on a 20 mil qfp due to this solder not being even or too high in spots and not covering the length of the pads. an
Electronics Forum | Tue Oct 06 17:17:44 EDT 1998 | Chrys
| We are experiencing poor wetting on various components placed on a PCB with En-Tek coating. Is anyone else experiencing simular problems ? We have the following questions: | | 1. How can the thickness of the En-tek coating be measured? | 2. Is En
Electronics Forum | Thu Jun 08 01:46:00 EDT 2023 | camilleyang3
To prevent BGA (Ball Grid Array) issues related to SMT (Surface Mount Technology) solder resist when fabricating a PCBA (Printed Circuit Board Assembly), you can follow these guidelines: Design considerations: Ensure proper spacing between BGA pads
Electronics Forum | Tue May 18 16:48:49 EDT 1999 | Tony
| | | | | What is the best way to re-ball a BGA? Who has the best system for doing it? | | | | | | | | | I'm using our SRT rework stuff to reball in house - when necessary. Of course, we only do this for protos and test boards. We use a standard mi
Electronics Forum | Thu Aug 22 01:57:30 EDT 2002 | Bob Willis
Although the following is not true capability machine assesment I feel that monioring the process at screen print, placement, reflow and wave gives results for both design and process guys to asses thire process. The project has been running since Ma
Electronics Forum | Fri Jun 27 10:27:59 EDT 2003 | davef
Since you�re asking the question about proper handling of OSP board, there may still be time to talk you out of using that material. * Cleaning of mis-printed board could cause non-wetting problems. This tends to remove a fraction of OSP coating. 0.3
