Electronics Forum | Mon Sep 25 09:42:51 EDT 2006 | slthomas
It sounds like it's just failing the laser align step. Try changing the align type for the part to "2" and see if it places it. If it's failing the laser align and you have valid part dimensions I can't help much but you might consider opening up th
Electronics Forum | Wed Oct 04 13:58:38 EDT 2006 | cw
hi Dave.F and All, I need to reflow SCA solder balls on Sn/Pb paste, i get a pretty OK solder wetting and collapse apperance, however, i am seeing voids everywhere, some of them is greater than 25-30%, which has exceeded IPC standard. Please advise.
Electronics Forum | Wed Oct 04 16:14:17 EDT 2006 | inds
what is your peak temp.. if you try to go too high say 225-230 deg C there is a fair chance of seeing voids.. depending on your ball size and paste volume you can get a good collapse at temps below 225deg C...
Electronics Forum | Tue Oct 17 09:27:23 EDT 2006 | SWAG
We had a build that showed a relatively high occurence of BGA voids like you were seeing. It was a very small volume first article that took a long time to get through the line so the paste sat on the boards too long. As we ramped up TACT time in p
Electronics Forum | Thu Nov 16 18:41:17 EST 2006 | John Fisher
Unidec repairs of industrial electronics specializing in the surface mount (SMT) and through-hole circuit board equipment, robotics, vision systems and general automation. Plese see our website at http://www.unidec.com of call toll free at 888-701-00
Electronics Forum | Thu Oct 12 09:22:12 EDT 2006 | charless
Hi We are experiencing different failure modes between leaded and lead free through hole assemblies. The boards are PTH. In the case of lead free boards we are seeing fracturing of the component legs much earlier than we do with leaded assemblies. N
Electronics Forum | Wed Nov 01 00:19:29 EST 2006 | Cingular Man
Are you setting up double side PCB that has the tall components on the bottom that being push up by the support pins... ??? Or because your vacuum is leak and not holding the board at the same spot every time you are loading the board.... Board warp
Electronics Forum | Mon Oct 30 21:43:08 EST 2006 | davef
So, after the repair of a BGA, you notice white reside on a nearby connector. Correct? [Sorry we're so dense. Long day.] Tell us about: * Flux class used in repair * Flux class used in original assembly Why are you baking the assembly after repair
Electronics Forum | Tue Oct 31 21:26:40 EST 2006 | davef
We've always used flux in reworking BGA, except with some dodgy designs, when we use paste. We see no reason to switch to paste. We do not understand your coworker's concerns, nor do we understand the impact of using paste because of the higher mel
Electronics Forum | Tue Nov 07 14:34:04 EST 2006 | jeffm
We are using Kester Type R520A, Alloy SN96.5/A63.0/CU.5 paste which is applied using an MPM Accuflex machine. Our plant Humidity is 38 degrees. We are seeing insufficient paste post stencil on fine pitch parts. Could this be an environment issue? In
