Electronics Forum | Thu May 15 07:37:49 EDT 2003 | pteerink
Have seen similar circumstances a couple times. Possible causes: 1) PCB defect - remove the BGA and inspect/test the PCB for shorts. ( trace short, layer short etc ) 2) PCB defect that only shows up when the BGA is populated - a short somewhere o
Electronics Forum | Fri Dec 27 09:45:04 EST 2002 | emeto
what exactly do you mean by big thermal pad?
Electronics Forum | Wed Feb 19 19:24:12 EST 2003 | arturoflores
Is there any way I can attach a report?
Electronics Forum | Tue Feb 18 19:07:21 EST 2003 | arturoflores
Our case is not due to thermal pad print squeezing because our shorts are mostly in the outer rows of the BGA so they cannot be caused by central pad printing. We still stick to the BGA thermal pad coplanarity/height hypothesis but have not yet prove
Electronics Forum | Mon Mar 15 08:06:46 EST 1999 | Ron Lahat
After rmoving a BGA (plastic)to correct unexplained shorts I installed another BGA using flux only. Checking on an X Ray machine and found two shorts. can anyone give a good explenation ? Thanks Ron
Electronics Forum | Tue Feb 18 22:15:04 EST 2003 | davef
Arturo, So, you're not shorting to a thermal pad. Given that you're shorting to outer balls, tell us about: * Location of the shorting among the outer balls. * Board construction. * BGA constuction. * Paste deposition. * Temperature measurements ta
Electronics Forum | Mon Dec 22 22:05:42 EST 2014 | slouis2014
What could be the possible solution for shorted BGA but only appears on the component corners. The BGA is 18mm x 18mm in size.The component solder balls are within specs and the pad design for the BGA is with standard. How can I solve this problem
Electronics Forum | Mon Dec 30 13:52:50 EST 2002 | bcceng
Haran, This problem can also be caused if the BGA package is POPCORNING. Popcorning causes the BGA package to expand below the die, seen this happen so often to customers that try to install BGA's themselves without the proper handling of BGA's. Tha
Electronics Forum | Fri Dec 27 01:30:13 EST 2002 | haran
Currently we are running a BGA with a big thermal pad in the middle of the package and encountered high defect of solder shorts.I would like to check whether anyone has experience this problem and how this can be rectified?.
Electronics Forum | Thu May 15 03:14:33 EDT 2003 | Hon Choi
Dear all, Not sure if you have this experience, but we've been seeing shorts on the BGA's from a widely known supplier "i". These shorts can not be found on the X-Ray, and when we remove the BGA, the component is ok. We peeled a few BGA's off, and
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