Electronics Forum | Tue Nov 13 09:36:18 EST 2007 | rgduval
From a manufacturing standpoint, this isn't very nice. Vias will tend to wick solder away from the pad, resulting in insuficient solder joints, which require touch-up. The amount of times any solder joint is reheated should be minimized, as extra h
Electronics Forum | Tue Jun 18 23:24:05 EDT 2019 | SMTA-David
Hi, I have a SMD radio module that has castellated Pads along one edge of the module. The pick and place machine appears to place them very well but when the boards come out of the reflow oven then up to 20% of them have either rotated a few degrees
Electronics Forum | Wed Jun 26 04:00:30 EDT 2019 | SMTA-David
Thanks, I'll take a look. Something else I found was the Z height for the module was set to 1.7mm but I am picking up the part on the PCB surface which is only 1.0mm from PCB being loaded, therefore the part must have been let got 0.7mm above PCB an
Electronics Forum | Tue Feb 15 00:27:39 EST 2011 | jeffr
First clean and de-bur the hole in the nozzle, then try it again. If the Head does not pick up at the feeder, then moves to the dump position...it means that the Vacuum Sensor Board has detected that the nozzle vacuum is above the LOW threshold setti
Electronics Forum | Fri Feb 03 10:34:09 EST 2017 | prdmm1
PANASONIC ERJ-12ZYJ203U i am having a lot of problems picking this resistor up. i have purchased a new tool per engineering (NOT the problem). it seems the my9 is picking up then dropping it. then the machine goes to pick another and picks the dropp
Electronics Forum | Wed Feb 08 12:18:18 EST 2017 | dyoungquist
It could be a part height issue. I have seen a case where an 0402 resistor from 2 different manufactures had different heights. If the height of your 2010 part is taller than you have programmed in the package data, the pick up head may be pushing
Electronics Forum | Tue Mar 13 19:27:33 EDT 2018 | maustin
I have an old Zevatech 740 machine that, until recently, was running well. In the last few weeks, the RH head has started giving me issues. When it picks up a component (and early on in most of my programs it will be picking up chip resistors or ca
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Mon Apr 04 12:16:32 EDT 2005 | DasonC
We make a custom mini stencil to print the paste onto the QFN and flip over to load on the rework station. The mini-stencil was designed for SRT to pick up the QFN. Check BeamOn (stencil house) for detail. Good luck
Electronics Forum | Sun Apr 22 23:46:28 EDT 2001 | z1040223
Hello all My company is getting ready to implement solder bump flip chips in the production line in the future. We are a contract manufacturer. We currently have the SMT facilities to do up to 1.5mm pitch BGA's, 0402 and other standard SMT. What equ
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