Electronics Forum | Sat Apr 21 14:50:17 EDT 2012 | edmentzer
We are using SN100C in both our wave and selective machines and have very good results. We also using it for ROHS hand soldering. It flows better than SAC305, the joints are shinny just like Sn63/37. We are looking into using SN100C as our paste b
Electronics Forum | Wed Oct 25 12:24:02 EDT 2000 | Philip
Hi Chris! I hope this will help you! The CBGA uses an array of high melting point solder spheres(Sn10/Pb90) to connect its ceramic chip carrier to an epoxy glass (FR4) PCB using eutectic (Sn63/Pb37) solder joints at both ceramic and card inter
Electronics Forum | Thu Oct 04 10:54:11 EDT 2012 | eniac
I have only one incredible idea: this is example of different speed of heat transfer of neighboring pads. I saw it two times during last years, but on lead solder pastes (Sn63Pb37). The reason of this mistakes each times we found two: 1. errors duri
Electronics Forum | Mon Sep 12 15:04:50 EDT 2022 | arminski
Will there be solder joint integrity issues if in Using Sn60/Pb40 on Sn63/Pb37 processed PCB during Rework? Thank you
Electronics Forum | Wed Oct 12 11:39:25 EDT 2022 | stephendo
There is only one tin/lead ratio that is eutectic. Sn60/Pb40 is not eutectic.
Electronics Forum | Tue Oct 11 20:06:16 EDT 2022 | emeto
In both cases you will be close to the eutectic composition(61.9%Sn), so I expect joint to be intact and uniform.
Electronics Forum | Fri Aug 14 15:43:36 EDT 1998 | Tom
Anyone know what difference it makes whether SN63A solder wire is 2% vs 2.2% flux - and why ?
Electronics Forum | Fri Feb 13 11:46:23 EST 2004 | Jack
Is your customer trying to reduce voiding? If the device is using Sn90 / Pb10 and the paste is Sn63/Pb37 the board will melt first. However, if both solders are 183C eutectic, it's a tossup? PCB design, copper weight, bga type (pbga, micro bga, Tbg
Electronics Forum | Sat Oct 01 01:25:30 EDT 2005 | ck
Sorry theres a mistake on previous question. It should be lead free component termination but non lead free solder alloy Sn63/Pb37. The reflow profile i am using : Soaking temp. 120 to 160 deg C; time 90 to 120 sec. Peak temp. 215 to 225 deg C; time
Electronics Forum | Tue Aug 14 21:43:44 EDT 2001 | mugen
Basic understanding, 1) the 2% silver (Ag) gives better shine *joint surface*. 2) Ag improves stength & fatigue resistance of solder joints 3) reduces leech-out of silver from silver-base substrates (eg of such silver-base surface contact: metalli
