Electronics Forum | Tue Apr 15 10:43:44 EDT 2003 | yngwie
Why is it people still prefer to do manual stirring of solder paste versus automated solder paste softener ? I learned that one of the dis-advantage of using the softener is that this method is actually seperating the metal and flux. Is there any oth
Electronics Forum | Fri Apr 18 19:27:29 EDT 2003 | yngwie
Under web search you type solder paste softener. It is meant to replace manual stiring process of solder paste prior use. I heard that the spinner/softener is no use as it will seperate the flux and metal content during the spinning process. But, I h
Electronics Forum | Wed Apr 16 03:16:11 EDT 2003 | emeto
Hi,what exactly means automated solder paste softener? Explain me please and I promise to try answer you correctly.
Electronics Forum | Tue Apr 27 00:18:08 EDT 2004 | Garian
Since you have used malcom softener, did you encounter and sudden rise of void level in the solder joints as compared to manual stirring?
Electronics Forum | Fri Mar 28 10:21:16 EDT 2014 | davef
With heat, most underfills soften just before the solder melts. So, keep poking the underfill until you see it soften. Then, wait just the correct amount of time until the solder melts and quickly snap or torque the part from the board. BR davef
Electronics Forum | Mon May 17 14:14:36 EDT 2004 | cg
Or is solder quality better with automated mixing?
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Fri Sep 01 03:06:20 EDT 2000 | Adelina Baggayan
Hi!, Can anyone help me with problems with Solder voids after reflow curing on D2PAK heatsinks? I would like to remove the gas from the solder paste; can centrifuge help?How many minutes should a solder paste in a tube be processed in a softener? Ho
Electronics Forum | Thu Oct 27 00:45:41 EDT 2005 | pavel_murtishev
Good morning, I can recommend to use solder paste softeners, which can prepare solder paste for printing process. Softeners rise paste temperature by means of pseudo-planetary motion. Therefore, solder paste reaches room temperature during only 15
