Electronics Forum | Thu Dec 07 17:25:58 EST 2017 | davef
Help me understand your issue better ... Are you looking to: * Improve your products that are used for thermal cycling testing of products of other companies? * Change your production materials so that you pass thermal cycling testing of your produ
Electronics Forum | Wed Jun 02 09:50:00 EDT 1999 | Earl Moon
| Hello all | I have a question concerning whether or not there is any special requirements to follow for assembly of a Polyimide PCB card. The customer has the following information on there documentation but since we have never built anything with
Electronics Forum | Thu Sep 09 11:17:59 EDT 1999 | Glenn Robertson
| Has anybody have any experience with Top placement of BGA's. GLue descretes on bottom and then wavesolder.? | | | Chris - This is a common practice. Just remember that BGA solder joints are especially susceptible to secondary reflow damag
Electronics Forum | Mon Jun 15 13:23:16 EDT 1998 | Bob Willis
| We are very concerned about outgassing in wavesoldering. | If anyone knows how to use properly well pcb's before soldering in order to avoid this problem please let me know. I have this problem in FR4 large double sided pcb's. My soldering line is
Electronics Forum | Thu Oct 24 17:32:54 EDT 2002 | ksfacinelli
The big problem we saw was the appearance of the solder joint after the water wash process. We saw the joints turn white through the absorption of moisture. Looked real bad but still functioned. I would stick with using only one of the processes a
Electronics Forum | Thu Feb 23 12:17:47 EST 2006 | mafc65
As Russ say, you can buy kits from Practical components and make your tries, the send those pcb's to your solder paste vendor for analysis.I am using Senju Lead free solder and I send boards to them then they cut the board and analyze your solder con
Electronics Forum | Thu Apr 02 14:58:49 EDT 2009 | vladig
Hi Peter, Have the plating thickness checked with XRF. If the layer of Au too thin, then Ni can diffuse all the way through it during the first run and the surface won't be perfectly solderable for the second side. it might also have a thin layer of
Electronics Forum | Tue Nov 03 06:23:12 EST 2009 | josh_brubaker
Has anyone ever done a tape test to see if the solder resist pulls away from the PCB? Is this an acceptable method for testing solder resist acceptability? This is an issue I am experiencing with our PCBs. I am receiving boards with excess solder o
Electronics Forum | Wed Jun 21 09:22:29 EDT 2017 | emeto
Hello, I have an assembly that I am considering to run in a regular process(SMT, Wave)and afterwords solder 22 electrolytic capacitors. Due to the multi-layer board it is not an easy task, so I was wondering if you guys know any trick how to do that
Electronics Forum | Wed Dec 18 16:21:54 EST 2019 | jrow
Hello! We are having field failures due to cracking of the solder on our SMD micro switch components. I have been reading the IPC standards, and the only thing that it states regarding the solder profile/amount for Gull Wing component is "wetted fill
