Electronics Forum | Wed Feb 09 21:41:49 EST 2005 | Grant
Hi, We have been running the same stencils for about a year, 5 thou thick, 1-mm pitch BGA's and every-things been ok, but then suddenly over the last week, 2 different products have had paste release issues with the BGA. It's odd because nothings c
Electronics Forum | Wed Aug 24 16:30:11 EDT 2016 | shawn_halo_1
I have a 1oz Flex PCB (FPC) that has 2 0.4mm pitch connectors that need to be SMTd and 9 4.5x1.0mm pads that have conductive rubber contacts that are press fitted onto the FPC. The FPC has a one time bend radius of 15.5mm. Image is attached that show
Electronics Forum | Tue Jul 27 16:44:31 EDT 1999 | Earl Moon
| | | Presently protos of micro-bgas (80i/o) pitch .030/.031 | | | 12BGA per assembly | | | | | | The board is a (.062, 4 layers) FR-4 using Dry film | | | Pads .014inch | | | Vias within footprint .020inch | | | Vias to be filled by bottom side(sol
Electronics Forum | Tue Feb 08 14:56:09 EST 2011 | rkr76
Hello everyone, I have a question regarding wavesoldering and measuring if a proces/machine is in control. I made a custom carrier for measuring contact time, parallelism, solder temperature, coveyorspeed and some data of the preheat section. The s
Electronics Forum | Thu Jul 30 16:38:40 EDT 2015 | lokit
There are several big competitors out in the field. Since a few years 3D AOI is getting more and more populair. The reliability is much higher compared to comparing grey scales (pixels) with one another. Measuring the height, length and width of a co
Electronics Forum | Thu May 25 17:18:45 EDT 2000 | Boca
I have not done pin in paste in production quantites, but speculation is always a blast so; OA fluxes are active at room temperature, they grow 'fur' with humidity if not washed off, great stuff for soldering, nasty stuff for reliability (if not rem
Electronics Forum | Wed Oct 21 16:23:11 EDT 1998 | Jeffrey Long
My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I di
Electronics Forum | Mon Feb 23 10:39:37 EST 1998 | Igmar
| I have been involved in SMT for only a few months so I am coming from a position of extreame ignorance. I have been asked to investigate the differences in soldering to components with Paladium coated leads vs the standard Tin_lead. I would appre
Electronics Forum | Tue Jun 05 14:36:55 EDT 2007 | stepheniii
No. It was CK who brought up AC at his home and erroneously said that having your AC on a lower setting used less power than having it turned off when you are not there. I'm saying with AC at home turn it off when you are not there and have it come
Electronics Forum | Thu Mar 13 14:12:31 EDT 2014 | davef
You're creating a new alloy on the surface of your board. The alloy will have a melting point determined by the constituent metals of the alloy. Your alloy consists of: * Lead-free HASL solderability protection on the board * Lead-free solder paste *
