Electronics Forum | Tue Aug 25 20:46:39 EDT 2009 | davef
We need more information and possibly a picture in order to help you.
Electronics Forum | Mon Jun 09 06:37:42 EDT 2008 | roc2x
Hi, After reflow process we do Automatic inspection and after that direct to 5DX machine to check all the solder joints and we detected it at 5DX inspection. This card havent go to any testing.
Electronics Forum | Wed Aug 30 14:57:43 EDT 2000 | John Thorup
Hello Craig Are code dates other than these two coming apart or do they stay together? If other dates stay together you should get together with RFM. Did the process work before and and the defects just start happening? These are pictured on the RFM
Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig
We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type
Electronics Forum | Tue Aug 07 08:20:47 EDT 2001 | CPI
Are there other components on the board? If so, how does solder quality look on them? Are they all reflowing? Are the sections of the uBGA�s sitting on a ground plane? Sounds like un-even heating. You should attach a couple thermal couples and see h
Electronics Forum | Fri Dec 08 19:09:44 EST 2006 | darby
I have just started production run using this component. After reflow I see that there is an undercut of solder between the pcb and the lead instead of a fillet. This means that some of the leads are sitting above the solder with no wetting to the co
Electronics Forum | Thu Feb 08 09:07:22 EST 2001 | Hussman
OK, without knowing the specifics, why does everyone blame the oven? Most solder balls occur around R's and C's in almost every shop I've been to. The best place to start looking is the screen printer - not the oven. Sure the oven is the last proc
Electronics Forum | Tue Sep 18 12:47:33 EDT 2012 | mbnetto
Hi, Regarding to thermocouple placement, you should use a precision thin drill. Drill through the bottom of the board to the top as follows: One hole in the center of the part, preferably into one of the center balls, if available. One hole into the
Electronics Forum | Wed Nov 14 12:11:04 EST 2001 | eabbott
We are experiencing many solder balls after wavesolder. Two different board suppliers of the same board are involved. My initial reaction was that it was the process but in researching information in this forum I am beginning to wonder. How can on
Electronics Forum | Tue Nov 27 12:12:53 EST 2001 | Justin
We have noticed that when you are using a no-clean flux with the wave solder process that you will have additional solderballs. One thing that we have done is to change the PCB finish to a matte finish. This has greatly reduced the number of solder
