Electronics Forum | Wed Mar 14 19:32:04 EDT 2012 | swag
You're not clear if you intend to reclaim and re-use the paste from the stencil or not. If not, then you should go to cartridges with an air gun or modify a caulking gun for dispensing paste from cartridges. The paste will last a long time.
Electronics Forum | Wed Mar 14 16:10:38 EDT 2012 | cobham1
We need to develop a method of putting solder paste on a stencil then putting the unused part back into the refrig. Reason we are thinking of this method is because we only run circuit boards twice a week. I dont want to waste entire jar of paste bec
Electronics Forum | Mon Oct 15 08:24:24 EDT 2012 | scottp
You could pay the extra to have the microvias plated shut and planarized. If your voids are larger than 25% of the BGA joint area then I would suspect a solderability problem. Either the board plating or a solder paste problem. If they're less tha
Electronics Forum | Mon Aug 27 01:48:06 EDT 2001 | apg
Dear Hussman We use automatic machines on mounting PHILIPS and though quality and velocity of their mounting are very good, the girls occupied with quality control can not on 100 % to check quality of the soldering FLIP CHIP and BGA!!! Pavel
Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng
janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa
Electronics Forum | Thu May 09 15:30:57 EDT 2002 | TomN
I'd be a more than a little cautious about doing this. Had a somewhat different application once and found out that as the solution was cleaning/etching the surface, it also leached (thru the lead frame) into the body of the part. What we thought w
Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan
Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so
Electronics Forum | Thu May 09 11:59:34 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Thu May 09 12:00:32 EDT 2002 | russ
One thing I have done in the past although it may not be feasable in your case, is to process through normal reflow and then saturate parts with a high solids water soluble flux and re-reflow with hot air, iron, or even another pass through the oven.
Electronics Forum | Wed May 08 23:48:01 EDT 2002 | ianchan
Hi mates, someone told us to use mild HCL acid 5% to 10% solution and submerge the LCC parts into this solution. hopefully this will clean off the varient copper oxide layer on the LCC leadless terminal wall. after the HCL soak, submerge the parts
