Electronics Forum | Fri Jun 25 14:39:59 EDT 2004 | Hoss
Any chance your potting compound was changed in the timeframe mentioned or the unit(s) were used under high heat stress conditions? If significant thermal expansion of your potting material happened and it is a hard durometer, it could shear at your
Electronics Forum | Fri Feb 11 01:36:22 EST 2005 | brown
OK I am counting someone knowing this. True or False, if my touch-up operators touch-up the smt solder joints too many times will this make the joint weaker? if yes why? and what happens to my intermetalic layer? I have insisted if it looks good don
Electronics Forum | Fri Dec 09 08:53:12 EST 2005 | russ
We used flash gold once by mistake and we did pay for it. A very high fallout of BGAs and some of the leaded devices for latent failures from fractured solder joints. I do not know how the other types of components faired in this process but I woul
Electronics Forum | Wed May 31 13:23:48 EDT 2006 | slthomas
You don't say anything about the appearance of the solder joints themselves. That would go a long ways towards identifying and possibly resolving your issues. Heating and cooling could affect performance if you have a/some cracked or otherwise loose
Electronics Forum | Wed Sep 30 11:32:45 EDT 2009 | pbarton
What type of conformal coating are you using and are you allowing the coating to migrate under the device in question? If you are allowing the coating unbder the BGA the problem could be CTE of coating is much greater than that of the BGA balls/sold
Electronics Forum | Thu Nov 05 13:00:27 EST 2009 | swag
The solder joints might hook up but my opinion is you'll end up with mechanically weak joints that could fail over time. If your trying to get your Xbox back on-line at home I'd try it but not if your charging $ to fix it for someone else or re-work
Electronics Forum | Wed Dec 14 06:32:20 EST 2005 | tk380514
Not all but some new boards we have had solder joint problems, for example some of the pads refuse to solder at all and the solder paste ends up attched only to the leg, reworking makes no difference and a variety of fluxes have failed. How can some
Electronics Forum | Tue Jan 15 13:16:25 EST 2008 | ck_the_flip
Yes, the previous "non-balling" flux was alcohol based, but very weak activity. We found it was worth the switch to water-based, to get prettier solder joints - but...at the expense of having to "brush off" solder balls on a couple of assemblies wit
Electronics Forum | Mon Apr 19 02:49:56 EDT 1999 | Raul N.
25 PPM)! 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate for the ga
Electronics Forum | Tue Aug 25 10:25:56 EDT 2009 | grahamcooper22
Do you know the exact BGA sphere alloy make-up and the alloys melt temp ? Then you can judge the ideal reflow temperature. Also, does the package warp in the reflow zone ? This may be causing the solder spheres on the BGA to lift off the pcb and henc
