Electronics Forum | Tue Jul 02 02:50:55 EDT 2002 | ianchan
Hi mates, was going thru the IPC-A-610C Standards, and noted BGA voids stands somewhere between 10%-25% voids permissible in the solder "ball" bump, after reflow process. Was wondering, hypothetical case study, is there any specification for voids
Electronics Forum | Tue Jul 02 07:11:31 EDT 2002 | davef
There is nothing inherently wrong with voids in solder connections. They: * Do indicate that the reflow soldering process is not well controlled. * Can comprise the strength of the solder connection. Look here: http://www.smtinfocus.com/smt_failure
Electronics Forum | Sat Sep 12 10:12:20 EDT 2009 | tylaburg
My customer wants an SnPb 63/37 BGA soldered using SAC305 solder paste. What data is avaiable showing the long term reliability of the intermetallics of the solder joints?
Electronics Forum | Sun Sep 13 09:21:26 EDT 2009 | davef
You as, "What data is available showing the long term reliability of the intermetallics of the solder joints?" Alloy||Microstructure Sn-Pb||Lamella or globules Sn-Cu||Sn-matrix, Cu6Sn5 needles or globules Sn-Cu-Sb||Sn-matrix, cuboids of SbSn and Cu6
Electronics Forum | Mon Jun 12 06:45:10 EDT 2000 | kim ji tae
Hi! Thanks all who upgrade these pages. I have some questions. Is there any answer? I do double-sided reflow solderig, with 0.4% AG solder cream. with AU finished pcb. First I do reflow solder bottom side where 0.5pitch TQFP locates. Second I do re
Electronics Forum | Mon Jun 12 22:00:51 EDT 2000 | Dave F
Could be. What are your profiles? 2) Au finish fail => Could be, but that the connections can be made with hand soldering makes this a low probability cause, assuming the activity of the flux used in hand soldering is not significantly different fr
Electronics Forum | Tue Jul 27 13:48:45 EDT 2004 | Ralf
Hi Recently i have noticed that after reflow (hot air oven) on the solder lands without components but with solder(screen printing) there is discoloration. It looks like gasolin spilled on the wet road (rainbow). Any idea and reason Ralf
Electronics Forum | Tue Jan 15 09:42:40 EST 2002 | davef
Here's two choices. 1 Before accepting a lot of boards from your supplier: * Print some paste on a board * Reflow the paste * Inspect the quality of the solder connection * Make a decision on accpting the board based on that observation. 2 Have yo
Electronics Forum | Wed Jun 14 08:08:56 EDT 2000 | Wolfgang Busko
Hi ji tae, we had a similar problem with QFPs 0,5 pitch processed by one subcontractor. The symptoms we noticed were: - the solderjointshape and wetting looked normal - the surface had a dull gray appearance - by pushing a lead sideways with a tweez
Electronics Forum | Fri Jul 26 05:14:38 EDT 2013 | anilw2006
We had a solder joint problem in gold plated PLCC68 ic. We do double sided reflow process with Cookson OL107F paste. First we do top with paste and second with glue process.The solder joint shape and wetting looked normal.In the process of testing
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