Electronics Forum | Tue Mar 14 12:16:10 EDT 2023 | proceng1
Are these molten solder bubbles, or another substance "foaming" up on the surface?
Electronics Forum | Tue Mar 14 14:34:02 EDT 2023 | joeljacobo
Hi, I think they are a bit of both. When they pop the bubbles something like a foam is generated.
Electronics Forum | Tue Mar 14 21:30:45 EDT 2023 | joeljacobo
Thank you very much for your contribution Stephen
Electronics Forum | Wed Mar 15 15:24:52 EDT 2023 | joeljacobo
In this case nitrogen is not used but thanks for your contribution!
Electronics Forum | Wed Mar 12 16:20:51 EDT 2008 | hussman
Poor training. Don't blame the operator, he was either shown this or left to his own devices. Be the better man and provide him a better process. Regular old peelabale solder mask would be a start.
Electronics Forum | Thu Jul 22 16:53:00 EDT 2021 | proceng1
Are you analyzing the solder in-house, or sending it to a lab? Our lab report gives the acceptable range, and our measured value.
Electronics Forum | Tue Mar 14 20:42:24 EDT 2023 | stephendo
In a previous lifetime, we had a selective solder machine where I would see solder splashes in the roof of it. I thought someone might have been putting the solder extremely high. But when it was melting there would be bubbles that burst. The manufac
Electronics Forum | Wed Mar 12 16:30:45 EDT 2008 | operator
I witnessed this at our sister company. It seems to be their standard process. It is not my place to interfere with their processes. I was just curious if there was any chance of brittle solder joints or other defects that might be caused from the WS
Electronics Forum | Mon Feb 06 17:19:59 EST 2017 | davef
Evtimov: IDEALS Project was one of the first to talk about componebt and board damage caused by LF soldering temperatures. There's lots of more current stuff on the web. Here's some that may help: * Assessment of Long-term Reliability in Lead-free As
Electronics Forum | Thu Jul 03 17:22:03 EDT 2008 | mikesewell
On an ACE KISS machine we could program a drop in Z height to give a peel off angle after the component was soldered. Usually not necessary as the solder at the nozzle is falling away from the lead down the nozzle. If possible, we would program a fr
.gif)
