Electronics Forum | Fri Jun 24 07:02:35 EDT 2005 | davef
Problem 1: Solder shortage * Stencil aperatures [except the heat slug] should be 1:1 with the board. * Stencil should be 5 thou thick laser cut. * Board should be 1:1 with the component * Print should look good. Problem #2: Bad connection between p
Electronics Forum | Mon Feb 27 09:09:36 EST 2006 | davef
Silver on your copper or brass part is a solderability protection. The silver diffuses into the solder and you solder to the base metal, either the copper or brass in your case. Soldering to copper is well known. The issues are soldering to brass
Electronics Forum | Thu Jun 02 10:54:12 EDT 2011 | davef
Al: We agree with AVFOM. You have a different problem than solder paste mesh selection. Most often, tombstoning occurs when the wetting forces on the two pads are unequal. Examples of things that can cause this are: * Pads are different * Board pad
Electronics Forum | Wed Aug 09 09:29:09 EDT 2017 | edhare
I recommend examining the problem pads and a representative bare board using SEM/EDS to determine if the problem is related to a board solderability issue. I can support this type of analysis (www.semlab.com).
Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef
Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of
Electronics Forum | Thu Jun 02 06:23:08 EDT 2011 | alcatel
1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.
Electronics Forum | Thu Jun 02 06:23:40 EDT 2011 | alcatel
1 chip has 2 solder pads....and both pads definitely has solder.... im not getting what you are trying to say.
Electronics Forum | Wed Jun 01 14:50:09 EDT 2011 | kahrpr
Try shifting the placement location slightly toward the pad that is not soldered. This is assuming it is always standing up on the same pad
Electronics Forum | Thu Jun 02 07:27:11 EDT 2011 | scottp
You need to post a picture or describe your geometry better. Is this a through hole via in pad or is the via offset from the pad with no soldermask in between?
Electronics Forum | Tue May 23 02:32:33 EDT 2017 | bukas
hello Zac, if you are running pump at 100% and there is not enough wave then you will probably need to empty solder bath and clean everything. also check pump parts for tear and wear. eached solder inlet can make a lot of problems when it comes to w
