Electronics Forum | Wed Aug 23 09:09:43 EDT 2000 | Dave F
Dr. Lee: Some say flux lowers the surface tension of solder. Others argue against that point. What is the flux mechanism that lets solder move more freely?
Electronics Forum | Wed Aug 23 09:05:38 EDT 2000 | Dave F
Dr. Lee: In using environmental screening tests to assess solder joint reliability, what are the effects that make low temperature vibration effective in screening of poorly wetted solder connections? What temperature and vibration profile are effe
Electronics Forum | Thu Aug 24 13:38:23 EDT 2000 | Dave F
It seems that sceening at -20�C and using a vibration profile similar to the one you mentioned does a good job of high-lighting defective solder connections on assembled boards, but not affecting good connections. Why is this happening? In there a
Electronics Forum | Thu Jul 20 16:14:59 EDT 2000 | Cole
How effective will current wave solder equipment and processes be with lead free solder? What temperatures will be required? How will dross generation compare?
Electronics Forum | Thu Jul 20 17:35:23 EDT 2000 | joevo2k
Bob, Is Nitrogen a "MUST" for reflow and wave soldering of the Lead-Free Solder Alloys ? And is post cleaning be a great impact when converting to Lead-Free Solders ?
Electronics Forum | Fri May 11 16:06:49 EDT 2001 | Charlie
How to solder one zero ohm 0805 resistor to a PCB after it is mounted in it's plastic. The Panasonic "Soft Beam" would do it if money were not a factor. Is there a similar type of soldering station out there that may just bolt to an existing conveyor
Electronics Forum | Tue Jun 12 18:42:44 EDT 2001 | htwyman
One of my FAQ pages relates to solder balls - check it out at: http://www.Twyman.org.uk/FAQ/Solder-Paste.htm Harvey Twyman http://www.Twyman.org.uk/CV
Electronics Forum | Mon Jun 18 11:06:31 EDT 2001 | Gil Zweig
In-line systems are effective in detecting the obvious defects such as solder bridges, missing balls and excessive solder voids. They may not be as effective in detecting the subtle changes in solder bond shapes (signatures) indicating loss or chang
Electronics Forum | Mon Jul 02 04:06:07 EDT 2001 | chinaren
Hello: Did anyone make some tests to show the adherence force between placed components and solder paste before soldering? and is there anyone who measure this adherence force during production?and any benifits fromthis activity? Thanks with best re
Electronics Forum | Thu Jul 05 07:34:57 EDT 2001 | steven
what is the main reasons that casuing solder ball during reflow? and how to remove them? (mostly arround the connector leads or between the 2 0402 chips). solder paste is RMA type. need advise. thanks
