Electronics Forum: soldering and iron and requirement (Page 7 of 13)

floor and air conditioning, shop floor requirements

Electronics Forum | Mon May 06 05:32:39 EDT 2013 | pavel_murtishev

Jim, Thank you for the input. Could you please check your standard filter pore size? A model number would be valuable. How many shop volumes (in cubic meters) do you pump per hour? Customer is seriously thinking over installing AC system similar to

Hand Soldering-Mixing Sn63 and L-F Processes

Electronics Forum | Tue Aug 09 06:21:19 EDT 2005 | bwet

Ladies and Gents: There have been several ways discussed in the trade press and in papers re: how to seperate/keep seperate Sn63 and l-f hand soldering tools. Some claim comepletel seperate hand soldering tools are required, while others claim that

QFN/BTC Side Termination - Fillets and Wettability

Electronics Forum | Wed Jul 19 12:54:04 EDT 2023 | calebcsmt

Since side fillets are not a requirement for QFNs/BTCs due to some packages not having wettable side terminations, how does one determine if the side terminations are actually solderable/designed for wetting? Is it simply if the side terminations

Re: Green coating and through-hole plating

Electronics Forum | Fri Aug 14 07:27:42 EDT 1998 | Earl Moon

| | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | Xingsheng | Xingsheng: Welcome. | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | Web resources: http://www.pw

Re: Green coating and through-hole plating

Electronics Forum | Fri Aug 14 08:59:51 EDT 1998 | Dave F

| | | Hi, can you please tell me how to make green coating and through-hole plating of PCB? Thanks! | | | Xingsheng | | Xingsheng: Welcome. | | Bible on PCB fabrication: Printed Circuits Handbook, Clyde Coombs, McGraw-Hill | | Web resources: htt

Re: SMT and TH board carrier

Electronics Forum | Wed Sep 01 13:58:10 EDT 1999 | Dave F

| Is it feasible to have one type of board carriers to take boards thru 1) glue curing process for first side and 2)invert carriers with boards, and 3)reflowing second side, and 4) do manual stuffing of th components and 5) take them thru selective w

SMT termination visual and solderability issues.

Electronics Forum | Tue Feb 14 13:16:49 EST 2006 | Carol Stirling

CRITICAL DILEMA! Has anyone run into the problem described below and if so, what was the fix (besides not dealing with this Supplier)? Also, we do not have component manufacturing process experience. We are purchasing a surge resistor that function

Re: Solderability of BGA and PCB

Electronics Forum | Mon Nov 27 17:47:23 EST 2000 | Dave F

Gyver: Lemme take a wack [if you�ll excuse the expression, given direction of the later discussion] at your questions. Q1. Will the baking of BGA or PCB cause more oxidation before the SMT process? A1. It certainly will not cause less oxidation,

Re: Solder Paste and Stencil questions

Electronics Forum | Tue Oct 12 22:22:34 EDT 1999 | se

| Hi, | We are in the process of evaluate our solder paste,incoming inspection over the solder paste, stencil requirments: | | 1- Is anybody using/requiring 1000 Kcps or more on viscosity to your solder paste provider ? Why ?? | 2- Is anybody using

Wave Soldering and Through Hole Forums

Electronics Forum | Thu Jan 24 19:58:58 EST 2002 | davef

for regular eutecticish solders, keep the pot temperature between 230�C [446�F] and 290�C [554�F]. If you polled us on our pot temperatures, we�d be all over the map, but with more lower than higher than you. High pot temperatures tend to generate


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