Electronics Forum | Thu Aug 12 21:06:48 EDT 2010 | ptpaazmi
COLD SOLDER LOCATION U600/U601 Problem : Several XMp3i Rotary swithes were found to exibit intermittent function during a DV build at WNC
Electronics Forum | Wed May 16 15:40:56 EDT 2012 | davef
Here's some notes from a Bob Willis presentation Assembly of Flexible Circuits with Lead-Free Solder Alloy [Bob Willis leadfreesoldering.com] * Flexible Circuit Construction ** Base Material - 0.05mm Copper 18/18 um ESPANEX from Holders Technologies
Electronics Forum | Tue Aug 24 20:15:27 EDT 2010 | davef
What is ... and how does it pertain? * Location U600/U601 * XMp3i Rotary swithes * DV build * WNC
Electronics Forum | Mon May 21 11:14:06 EDT 2012 | joeherz
Polymide is like a sponge and absorbs moisture much faster than rigid substrates. Pre-bake your substrate for 2-4 hours at 125C and perform your soldering within 1 shift thereafter or seal in moisture barrier bags.
Electronics Forum | Wed May 16 11:19:08 EDT 2012 | fulgen
Hi Guys, I´m looking for information about processing smt components on flexible printed circuits (printing, SMD assembly,reflow soldering and laser cuting). These flexible circuits comes from a roll of 300 mm width. I found some information about ro
Electronics Forum | Thu Nov 09 23:27:53 EST 2000 | Craig
We are considering using gold plating on our fine pitch pcbs (as oppossed to HASL). We have heard of long term solder reliability problems with joint imbrittlment how bad is this and does it apply for all of the different plating processes the same?
Electronics Forum | Fri Dec 29 08:14:19 EST 2006 | joey_dragon
Thank you for the quick reply! Actually, the "type B" I referred to applies to a flex cable that can be found in this page: http://www.tennrich.com/trtw/cabling_3.php It is a reverse Engineering project and, from what I can see, there is, indeed,
Electronics Forum | Fri Nov 10 17:44:48 EST 2000 | Dave F
In response to your questions: Is the embrittlement from excess gold in lead / tin solder connections bad? It can be vereeee bad. Does it affect all plating processes the same? Give us a break and read the SMTnet Archives, for instance: BGA prob
Electronics Forum | Tue Jun 06 15:42:36 EDT 2017 | stratsmyboy
Hi im new to the forum. We have product where we have applied a carbon finish. I want to remove the carbon to reapply but cant seem to find a solution. Its baked onto solder mask. Any ideas? I was hoping something non abrasive to save scratching the
Electronics Forum | Thu Dec 14 10:14:04 EST 2000 | PeteB
Jacqueline, Asuming you mean immersion silver: Advantages - Very flat finish compared to HASL, more easily solderable than bare copper with OSP and more process tolerant than this in our experience, reasonable shelf life, cheaper than immersion gol
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