Electronics Forum | Thu May 24 14:03:09 EDT 2007 | grantp
Hi, I am ok either way, and the main reason I originally went with Soltec was the overall oven design seemed cleaner than ERSA. The soltec had good performance, but the oven design was neat internally, where the ERSA seemed to be a bit of a mess.
Electronics Forum | Wed Apr 16 07:31:45 EDT 2003 | brobinson
Anybody know a site that lists example oven profiles? I am looking to write a profile for 120 C for 15 minutes through a Vitronics Soltec XPM Reflow oven. Rather than guess, a rough starting time for belt speeds would be nice.
Electronics Forum | Wed Feb 01 00:21:12 EST 2017 | shahrat
Hi, Between Vitronics Soltec & Heller which reflow oven would be be better for mobile phone production?? Can anyone give me the answer with technical reason. Thanks
Electronics Forum | Tue Jun 03 10:38:20 EDT 2014 | patel_daxa29
Thank You Chris.
Electronics Forum | Sat Dec 17 08:25:13 EST 2005 | grantp
Hi, Yes, I was talking about the oven, but then thinking about Soltec in general and about things the software really should be able to do, got me worked up on the Deltawave. I guess the frustration with it's software is not far from the surface.
Electronics Forum | Tue Jul 22 16:51:14 EDT 2008 | maxpower097
OK I have read though all the treads and learned more. One more question if someone can answer it. Can I do this myself on site? We have a Vitronics Soltec XPM820 Reflow Oven. Or do I need a super special oven for component baking.. Thanks max
Electronics Forum | Sun Nov 19 23:28:38 EST 2000 | Richard Metrton
Hi, We are looking at both the Vitronics Soltec and the Ursa Hotflow with the flux management options and am intrested to hear what others on the forum think about these two products. We really want something low maintenance, and works well. I gues
Electronics Forum | Tue Jun 03 10:30:36 EDT 2014 | cbeneat
We have the same ovens, our 2 sided boards have the same profile for both sides. Haven't seen a problem in 8 years.
Electronics Forum | Tue Jun 03 08:33:06 EDT 2014 | patel_daxa29
Do I need to lower temperature of bottom zone (for common size parts) while reflow 2nd side of the board or I should be using same profile as I used for 1st side reflow? Will parts on bottom side will stay in place without changing temperature?
Electronics Forum | Tue Jun 03 12:08:14 EDT 2014 | emeto
I don't think you decide that based on the oven. More important is what kind of parts you have on the board. If you have big heavy parts you should run them as second side.Of course you have the option to put glue under the suspicious part and run it
