Electronics Forum | Thu Jun 14 11:43:52 EDT 2001 | gsmguru
Change times for the Rheo pump are probably a little slower than just swapping blades. You have to hook up the sensors & air lines,remove the bottom cover + charge the pump to get it to operating pressure before you can print. I would guess that if y
Electronics Forum | Wed Apr 19 10:27:30 EDT 2006 | russ
Look at your paste specs, they give you recommended starting points relating to speed and pressure. Dave F is right, it is usually about 1 pound per linear inch of squeegee length. Speed for finepitch printing should be started at about 1in/sec. T
Electronics Forum | Sat May 12 00:04:36 EDT 2001 | zam_bri
The product I'm running currently consist a mix of 20 mil pitch QFP, 50 mil pitch, 0402, BGA and variable size of connectors from small to big, on OSP finished PCB. Running intrusive reflow with a mix packages is a real headache, esplly when you hav
Electronics Forum | Wed Sep 19 14:23:31 EDT 2001 | jschake
Pad Metallurgy Used: Copper OSP pads were used for all of the results that I have been reporting. The same design test boards with Nickel/Gold pads are available and awaiting further assembly tests. I will consult with a board technology and metall
Electronics Forum | Tue Dec 28 21:51:04 EST 2004 | KEN
When using a foam fluxer: 1. Bubble size is important. What stones are you using? Ever clean them? Too large a bubble will NOT help your situation. (I forget bubble size range....check with your fluxer mfgr.) 2. Thinner will help in capilary m
Electronics Forum | Wed May 08 09:15:26 EDT 2002 | pjc
Stencil Thickness, Squeegee Type (plastic/rubber vs. metal) and Squeegee Pressure.
Electronics Forum | Thu Aug 12 22:31:10 EDT 1999 | Dave F
| Hello, | | Can any netters suggest what critical parameters should be considered & what are there assoicated impacts for a solder paste printing process ... | | B.Regards, | Felix | Felix: There are some 30 variables that affect SMT solder qua
Electronics Forum | Fri Aug 13 18:38:47 EDT 2004 | russ
Your paste manufacturer will have the best guidelines for you. Different paste types and manufacturers sometimes/usually require a little bit different setup. I would also contact your printer manufacturer. As far as stencil concerns the larger/be
Electronics Forum | Mon Nov 22 11:19:39 EST 2004 | davef
Short answer: Yes. Depending on the application of the conductive ink, suppliers select different mesh for the silver particles. So, you should follow your supplier's recommendations for printing, for instance: Conductive Ink||PI-2000 Highly Condu
Electronics Forum | Fri Feb 24 08:29:25 EST 2006 | davef
Step stencils are not widely used, due to: * Higher cost as compared to uniform thickness stencils * Danger of solder paste smearing at least close to the steps * Difficulty of cleaning the stepped stencil underside (the steps cannot be on the upper
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