Electronics Forum | Mon Sep 14 14:02:45 EDT 1998 | Bill Schreiber
Dear Larry, I developed the ultrasonic cleaning process for Smart Sonic. It has developed into the most widely used stencil and misprinted PCB cleaning process worldwide. With that in mind, I offer some words of caution. "IT'S NOT THE ULTRASONICS!
Electronics Forum | Mon Jun 01 14:35:59 EDT 1998 | Rich
| | | | | | Thanks Steve- | | | Here is the whole story: | | | | | | The solder balls are appearing all over, similar to a | | | splatter. They are relatively small. We are using H-Technologies | | | S-HQ no-clean solder paste. The stencil is
Electronics Forum | Mon Jun 24 18:45:06 EDT 2002 | jersbo
I have done experiments on small runs, with a few connectors and have had favorable results, I had apertures (oversized)made for the thru-hole connectors on our SMT stencil and hand inserted the connectors.. A few insufficient solders here and there
Electronics Forum | Tue Dec 14 12:00:34 EST 1999 | Kris Wiederhold
We recently reduced our standard aperture reduction to aid in the reduction of solder on gold defects. Since this reduction in aperture size, we have been experiencing exposed copper at the end of the component pads. The heel and toe joints are per
Electronics Forum | Tue Dec 21 11:49:33 EST 2010 | remullis
1st the buyer shouldn't control the process based on cost. Let them buy stuff and stick to that. 2nd, I do think leveling in th HASL process is important. If you have high spots on pads for fine pitch your wiping away more of that aperture than othe
Electronics Forum | Fri Dec 01 12:56:33 EST 2017 | emeto
It seems that it will work with 5 mil stencil. To be safe use 4 mil if the rest of the design allows it. 10x20mil apertures for both rows. If you have bigger footprint in the corners, make bigger apertures there. For the ground plane, I would use ver
Electronics Forum | Mon Sep 23 10:45:34 EDT 2019 | slthomas
I have seen similar things happen with over etching and bridging but frankly the most common mistake that gives us grief is a failure to use the component manufacturer's recommended land pattern and/or aperture designs. As opposed to generating a n
Electronics Forum | Thu Oct 12 11:08:20 EDT 2000 | Fraser
Dave, Why on earth would you want to use a stepped glue stencil?. If you print slightly off contact the hight of your glue deposition will be roughly half the width of your adhesive aperture width so if you want a 10mil high deposit use a 20 mil ape
Electronics Forum | Mon Sep 21 22:25:05 EDT 2009 | davef
What babies!!!! Sure, give it a try. * Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print height equals 1/3 thickness] * For 0603, a
Electronics Forum | Fri Oct 09 06:32:38 EDT 2009 | davef
Here's what is on that post referred to, not sure what you need more than ... "* Stencil material: metal or plastic, no difference in print, metal is easier to clean, no static problem, available * Stencil thickness: Chips 0.006", SOIC 0.010" [print
