Electronics Forum | Wed Feb 20 23:17:34 EST 2002 | surachai
I AM JUST EVALUATION LEAD FREE EVALUATION AND FOUND THE BIG PROBLEM OF SOLDER CRACK BETWEEN TERMINAL OF COMPONENT AND THE INTERMETALLIC LAYER OF LEAD FREE ALLOY BUT DON'T FIND ANY CRACK BETWEEN SOLDER AND SURFACE OF PCB , COULD YOU HELP ME VERIFY T
Electronics Forum | Fri Mar 15 14:27:21 EST 2002 | stefwitt
Assuming, you have nothing on the other board side, I would drill a hole through the trace and board with a step drill and a drill press. If you adjust the depth control carefully the wider step of the drill scratches the surfaces of the trace to mak
Electronics Forum | Mon Apr 01 13:11:33 EST 2002 | BTaylor
I would like to know if this group has any preferences to any capacitor manufacture. Any good or bad experiences with certain companies, we are going through some issues. This group has many years in this field and I would like to hear your feedback
Electronics Forum | Mon May 13 09:49:18 EDT 2002 | Roger
Is there any difference in performance when running paper tape or plastic? What's the smallest passive component that you have fed in the feeder? How does pressure sensitive adhesive (PSA) tape perform in the feeder? PSA has a tendency to transfer
Electronics Forum | Tue Jun 04 12:26:40 EDT 2002 | Hussman69
If you have solder balls in vias on the "component side" it probably is your wave solder process. Most waves have an option that is designed to make sure your surface mount parts solder - but if turned up too high, can actually push solder up throug
Electronics Forum | Wed Jun 12 10:53:15 EDT 2002 | genny
350 candlepower is fairly low for high detail work. I spent some time in the construction industry laying out electrical blueprints for schools, and such. It was desirable to have more in the order of 700 fc for the desk surface that kids would wor
Electronics Forum | Wed Jul 03 22:35:02 EDT 2002 | Stephen
If you can solder in an inert atmosphere you'll find the problem will disappear, even blowing N2 over the surface while soldering will solve the problem. 10�C over peak is not excessive, I've run up to 350�C in some cases, protected by N2 the flux wi
Electronics Forum | Thu Jul 11 17:26:27 EDT 2002 | Tony B
Does anyone know how the Fuji IP2 can be adapted to place BGA's? The MTU places the chip on a carrier with suction in the center and it will not hold on to the BGA due to the lack of a flat surface on the bottom. I have had limited success building
Electronics Forum | Fri Jul 26 14:36:31 EDT 2002 | blnorman
Is anyone aware of a fog test for flux or flux residues? Supposedly one of our vendors had a test, but we've lost the specifics. We're interested in finding out if after heating, some of the residues (retained volatiles, or whatever) will escape an
Electronics Forum | Wed Aug 21 10:26:08 EDT 2002 | stownsend
We are using OSP coated boards and no-clean solder paste. In a few instances, we are seeing increased distortion in an audio circuit. Has anybody seen or heard of surface insulation resistance (SIR) decreasing after reflow on OSP boards? Is it possib
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