Electronics Forum | Fri Sep 06 17:21:24 EDT 2013 | rodcr
Why do PCB traces need a surface finish? On microstrip (top/bottom) the solder mask does not help
Electronics Forum | Tue Aug 24 13:45:17 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:14 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Tue Aug 24 13:47:16 EDT 2004 | Indy
Hi, I am trying to assemble a LTCC component with Pd/Ag surface finish on to Sn/Pb/Ag solder and Sn/Ag/Cu solder. I am passing it through a reflow. I have observed poor wettability at the solder-pad joint. Does anyone have information regarding th
Electronics Forum | Sun Jul 04 19:49:05 EDT 2004 | indy
Hello Everyone, We are having some problem with Palladium-Silver surface finish. We have ceramic components with the above surface finish. When we try to assemble these on Sn/Pb solder, we are observing open joints. If we reflow the compt for more t
Electronics Forum | Tue Aug 24 14:49:58 EDT 2004 | jamyboy
Hi, I am trying to assemble a LTCC component > with Pd/Ag surface finish on to Sn/Pb/Ag solder > and Sn/Ag/Cu solder. I am passing it through a > reflow. I have observed poor wettability at the > solder-pad joint. Does anyone have information
Electronics Forum | Sun Sep 08 15:07:42 EDT 2013 | davef
PCB designers specify the application of solder mask [eg, varnish, solder stop mask, solder resist, etc] to fabricators to reduce the potential of bridging between two conductive traces during assembly soldering processes [eg, wave, reflow and hand s
Electronics Forum | Mon Sep 09 21:54:01 EDT 2013 | mandysmile
Hi, rod, The exposed copper area you could do with ENIG. It is with good solderability.
Electronics Forum | Sun Sep 08 18:06:30 EDT 2013 | davef
Protect the board: If solder mask protects the board, the level of protection is limited and inconsistent. If you want protection, you need the be thinking conformal coating. Selective ENIG: I believe the reason solderability protection, except mayb
Electronics Forum | Thu Aug 12 20:32:44 EDT 2004 | usdigital
Indy, We use Palladium silver surface finish parts for silver epoxy attached parts only. It is our understanding that this finish is not for solder, but only silver epoxy attach. I expect that is you problem. Dave
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