Electronics Forum: systemation (Page 507 of 594)

Controlling Solder Ball Contamination

Electronics Forum | Wed Feb 21 18:07:00 EST 2001 | billschreiber

Hi Ramon, The obvious answer you might expect to here from me is that you could probably reduce your misprint problem if you had a good stencil cleaning process. Please see my response to the question by MarkT on �Cleaning Materials� because it i

Metal foil is pulling away from the screen.

Electronics Forum | Mon Feb 19 14:17:21 EST 2001 | bschreiber

Hi Mark, If you are a user of stencils, you already know that there are literally hundreds of stencil manufacturers out there. If you found one that will allow such hot temperatures, I would be interested in learning who it is. However, I have only

Fine-Pitch Applications

Electronics Forum | Mon Feb 19 12:43:16 EST 2001 | billschreiber

I�m going to reference Mr. Clouthier�s article again. It seems that the information contained within his article is answering many of the questions that are being asked. I highly recommend that everyone reads it. A copy can be found at the followi

laser or ink jet marking of pcb's

Electronics Forum | Thu Mar 08 09:38:35 EST 2001 | blnorman

We've been using pre-printed labels on our PCB's for years, with 8 - 10 hours a week down time associated with them. Last October we put a CO2 laser marker on one of our lines. In 6 months we've had a total of 30 minutes down time. We use a 2D b

Researching stencil cleaners

Electronics Forum | Tue Mar 27 18:58:36 EST 2001 | Mike Konrad

Hi Kerry, You are putting too much emphasis on the EPA�s �ENVIRONMENTAL TECHNOLOGY VERIFICATION STATEMENT� Consider the following EPA statement taken from the specific EPA report that you site: �� the end-user should contact his/her local, state,

Solder Paste Volume

Electronics Forum | Thu Mar 29 15:29:11 EST 2001 | johnw

measuring Paste volume or at least paste height is an essencial part of any SMT process. You've got to control those input's.... Paste volume determines how much solder is available for your joint so theres a direct to joint reliability / PCB reliabi

SMTECH pro's and con's

Electronics Forum | Mon Apr 30 18:17:16 EDT 2001 | ianlg

Hi Barry Unable to assist on specifics but I can tell you that some 74 100is machines were built. The majority residing in China Imported in by Wong King Kong Ltd ( Johnson lee Tel 00852 2357 8888 ) Most are at either Flextronics or Roslare. You mi

Thank you.

Electronics Forum | Tue May 01 12:16:25 EDT 2001 | kaoni

I really appreciate your advice. Dave did not offer much in the way of real advice, his response was mostly diatribe. I am looking at visual inspection at this time as AOI might be overkill in my case. I believe that it, in combination with the machi

Re: 2nd reflow

Electronics Forum | Thu Oct 26 17:48:12 EDT 2000 | ptvianc

Hi: Generlly speaking, in a reactive mode, nitrogen blankets are used to improve the yield of a process that is marginal in terms of removing, and/or preventing the re-appearence of, oxides on copper features or component I/Os. That marginality can

Mydata Pick and place

Electronics Forum | Wed May 09 12:07:52 EDT 2001 | caldon

My personal favorite is the Siemens F series and the UIC GSM platform. Both Siemens and UIC have awesome resources for csp, flipchip and baredie processing - Siemens= Dan Baldwin from GaTech; UIC = George Westby from UIC labs. My second choice would


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