Electronics Forum | Sun Apr 14 14:13:25 EDT 2002 | davef
I assume you're looking at stencil fab equipment because you need 'faster turns' than you can get from available stencil suppliers. While you're assessing this, consider other alternatives, such as: * Dispensing paste. [A very funny SMTNetter, livin
Electronics Forum | Fri May 24 17:28:04 EDT 2002 | fastek
Good points regarding Sanyo. I believe they were the first to introduce the "Direct Drive" concept. It's quite impressive. Panasonic probably ripped them off when designed their MSR's. It's interesting to note that an FCM-2 placing 96,000 comp. per h
Electronics Forum | Wed Apr 24 10:32:47 EDT 2002 | dougt
BGA's are sometimes difficult for a camera to recogonize as your not looking for the dark outline of a part with white lighting behind it but rather the white balls with in that dark component. If you don't mind experimenting a little I would play wi
Electronics Forum | Tue Apr 23 07:38:27 EDT 2002 | jeremyt
Hi there. I Have a question that hopfully someone on here can answer for me. On a Universial GDM, is there anyway to get all 4 pumps (pistion style) to purge at the same time. The software only allows for one pump at a time. The reason i am trying to
Electronics Forum | Tue Apr 23 15:53:52 EDT 2002 | HAN PHAN
I'm researching the history of SMT. In particular, I'd like to get some general information on MILESTONE events like: FIRST IC COMPANY TO RELEASE IT, BOTH TO DEFENSE INDUSTRY & TO THE MASS MARKET. WHEN? WHICH COMPANIES & MARKETS (TELECOM, COMPUTE
Electronics Forum | Wed May 15 12:55:11 EDT 2002 | fmonette
Hi Dave, The short answer is "not any significant amount" of moisture is removed during reflow. The temperature excursion is much too short. If you look at the physics of moisture diffusion inside a package you will see that only the surface moist
Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan
Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so
Electronics Forum | Tue May 14 13:18:33 EDT 2002 | Scott B
I think what David was getting at was, as an example. Take a cubic inch of gold. Surface area = 6 sq/in. Volume = 1 cu/in. Water displacement = X. Mass = Y Roll that cube of gold out to a micron thick. Surface area = football pitch. Volume = 1 cu/i
Electronics Forum | Fri May 17 03:04:15 EDT 2002 | Mike Konrad
This conversation reminds me of the old �How Many Engineers Does It Take To�� joke. We manufacturer the ionic contamination (ROSE, SEC) testers and I am not aware of anyone that performs such exacting surface area calculations. Most people use th
Electronics Forum | Wed May 22 13:07:43 EDT 2002 | melsolutions
Tim, have you considered how efficiency software plays a role in the matrix? Most software from equipment suppliers tends to be programming driven. I have run across a software product from Timms that does an excellent job of controling things lik
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