Electronics Forum: take (Page 274 of 468)

double side reflow soldering

Electronics Forum | Wed May 15 12:55:11 EDT 2002 | fmonette

Hi Dave, The short answer is "not any significant amount" of moisture is removed during reflow. The temperature excursion is much too short. If you look at the physics of moisture diffusion inside a package you will see that only the surface moist

Micro Leadless Frame - solder wetting control

Electronics Forum | Thu May 09 22:32:50 EDT 2002 | ianchan

Hi Guys, thanks to everyone for their help and advise! we are running these LCC parts in the 1000's, so its going to pose a big problem to either: 1) tin-plate the oxide layer, 2) HCL away the oxide layer, thanks for the option shown, dun think so

Calculating PCB surface area

Electronics Forum | Tue May 14 13:18:33 EDT 2002 | Scott B

I think what David was getting at was, as an example. Take a cubic inch of gold. Surface area = 6 sq/in. Volume = 1 cu/in. Water displacement = X. Mass = Y Roll that cube of gold out to a micron thick. Surface area = football pitch. Volume = 1 cu/i

Calculating PCB surface area

Electronics Forum | Fri May 17 03:04:15 EDT 2002 | Mike Konrad

This conversation reminds me of the old �How Many Engineers Does It Take To�� joke. We manufacturer the ionic contamination (ROSE, SEC) testers and I am not aware of anyone that performs such exacting surface area calculations. Most people use th

High-mix, Low-volume Manufacturing

Electronics Forum | Wed May 22 13:07:43 EDT 2002 | melsolutions

Tim, have you considered how efficiency software plays a role in the matrix? Most software from equipment suppliers tends to be programming driven. I have run across a software product from Timms that does an excellent job of controling things lik

Fiducials on feeders

Electronics Forum | Wed May 22 15:56:43 EDT 2002 | stefwitt

The play of the tape is quite significant as I mentioned in an earlier thread. Tape width can vary between 8.1 +/- 0.2mm. Demos on 0201's are most likely done with 8.1 +/- 0.05mm tape. I guess you are referring to the cover tape pull, which can dispo

Profiling board

Electronics Forum | Thu May 23 11:23:47 EDT 2002 | yngwie

Hi guys... Has anybody hv an experience with using a common or standard profile to reflow high mix brd ( say, low, medium and high )?. The reason for asking is that, we are running high mix low volume, and materials that were consigned is exactly as

AOI vs AXI

Electronics Forum | Sun Jun 09 19:02:15 EDT 2002 | Ken G.

Sam, I can tell you right now that if you have a low volume hi mix application where the program/job is changing every day, an AXI system is not going to be a good fit. As you alluded to, the programming time is onerous, the fine tuning or tweaking i

Production Line Setup

Electronics Forum | Wed Jun 19 12:42:45 EDT 2002 | nuezmaster

The problem that my exec. had was that he did not want to add too many people to the department because there is no telling how long the demand will stay high. Therefore, I decided just to add a PCB inspector between the Pick and Place machines and

BGA excursion placed by IP3

Electronics Forum | Tue Jul 02 08:59:14 EDT 2002 | jax

On an IP3, from what I remember, the BGA Part data is defined from center part moving out towards part edge. If your pick up point is a little off this problem can occur. Otherwise, Check your gain and offset settings. The machine is probably recogni


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