Electronics Forum: tear (Page 1 of 17)

Fillet Tearing

Electronics Forum | Wed Mar 22 01:24:54 EST 2006 | Joseph

Dear all, Referring technical report from Vitronics Soltec, "Pad lifting, fillet lifting and fillet tearing issues in LF soldering". The use of LF solder alloys today has brought about a recurrence of this crack formation, called fillet tearing. The

Cover tape tearing

Electronics Forum | Wed Dec 14 22:43:46 EST 2005 | 00629

Im from a semiconductor manufacturing company and we received feedback from customers about cover tape tearing on 16mm heat activated cover tapes...the manifestation of the tear is that it starts from both sides of the seal and continues towards the

Fillet Tearing

Electronics Forum | Wed Mar 22 09:51:41 EST 2006 | PIC

Bomb europe!

Hot Tear/Shirnk Hole>Will it happen on BGA joint ??

Electronics Forum | Tue Aug 05 01:13:22 EDT 2008 | Sean

Dear all, As far as I know hot tear or shrink hole defect only happen at plated though hole soldering, especially for those lead free wave process. Recently, a laboratory engineer had done cross section on some of the SMT BGA ball and IC lead solde

Cover tape tearing

Electronics Forum | Thu Dec 15 19:45:15 EST 2005 | Liza

Hi Rob, I would be asking the customers about that. I've read somewhere that teflon is used on feeders, is this a standard and does the absence or presence of this contribute to tape tearing? Thanks, LIza

Fillet Tearing

Electronics Forum | Wed Mar 22 12:28:33 EST 2006 | Rob

Leave us alone, olive oil isn't the same as crude! Defect of the month is... hot tear. http://www.smartgroup.org/pdf/Defect01.pdf

Hot Tear/Shirnk Hole>Will it happen on BGA joint ??

Electronics Forum | Fri Aug 08 07:15:49 EDT 2008 | davef

Hot tear occurs at the surface of the solder connection. The surface will look like someone tore the surface apart. So, it is a crack or fracture formed prior to metal solidification.

Big Holes (no Pun intended) in the IPC610D Criteria for Shrink/t

Electronics Forum | Fri Feb 17 13:10:34 EST 2006 | amol_kane

I have Immersion Ag and Immersion Sn LF boards that were waved using SAC305 alloy. I have a lot of tears/shrink voids in the waved connections. I am aware that SAC305 in wave has a propensity of shrink tears/voids due to the non eutectic property of

Hot Tear/Shirnk Hole>Will it happen on BGA joint ??

Electronics Forum | Wed Aug 06 08:09:57 EDT 2008 | davef

We agree that the squigglie part of the section of the BGA ball looks like something other than 'hot tear.' We'd guess that it is an inclusion, but it could be a sectioning defect, as you say. We agree that the majority of occurances of hot tear are

Fillet Tearing

Electronics Forum | Wed Mar 22 17:37:33 EST 2006 | russ

I like the "if you can see the bottom" part! would that include Xray inspection?

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