Electronics Forum | Thu Oct 02 18:53:36 EDT 2003 | Michael Nguyen
We are using a Trek board washing system with 2 deionizer tanks hooked up to the 2 final rinse tanks and the first tank is directly connected with the city water. We are having problems with a vendor board on some tranformer/chokes. The part manufact
Electronics Forum | Sat Feb 05 09:08:18 EST 2000 | Dave F
Casimir: Let me expand on something that I said in my response to your thread on ionic testing. Generally, no-clean people don�t use ROSE testing as part of their process control, because the ROSE test is essentially washing your board in DI/IPA �
Electronics Forum | Thu Sep 30 13:37:08 EDT 1999 | Dave F
| | I am having problems processing immersion gold boards. The achieved solder joints appear acceptable a la IPC-A-610, but the resultant joint does not fully cover the land, i.e. you can still see an outline of gold pad. | | What is the best way to
Electronics Forum | Mon Feb 14 12:07:47 EST 2000 | Dave F
Leslie: Product screens and tests of prototypes and test vehicles should be tailored for the specific goal and product. I caution your use of equations and test condition information without specific use environments and design conditions. Lawyer:
Electronics Forum | Wed Jan 30 15:46:32 EST 2013 | davef
First, look here [http://www.ti.com/lit/ug/snva500/snva500.pdf ] This is the actual pdf from TI, not some cheap-ass reproduction, like the link you gave us. Orange polygons [and other shapes] - copper covered with ENIG * On the edge of the board, bo
Electronics Forum | Thu Oct 12 16:55:19 EDT 2006 | realchunks
This type of testing is only done to verify your reflow process. It is destructive testing and should not be performed on product reaching your customer. Solder is only used to provide the electrical connection from part to board. As a metal it is
Electronics Forum | Tue Sep 03 22:32:04 EDT 2002 | davef
Naw, alcohol and solvents won't do dip. Hold-off on: * Destructive testing. [Athough this will convince you to move on to other things.] * Rework of the solder connections. [Although this will correct the problem.] Consider investigating your aque
Electronics Forum | Wed Mar 30 16:46:03 EST 2005 | chunks
There is no spec because solder is designed to provide an electrical connection not a mechanical connection to hold the part on. If it where mechanical we�d be welding our parts on. Your pad width and length are derived from your component manufact
Electronics Forum | Wed Jan 27 10:03:39 EST 2016 | mjscottinnc
Through trail and error we figured that out the Ethernet connections from the MC to SC. We have gotten past the Software booting wait and are now waiting to connect to Siplace Pro. The machine came with no documentation other then what the service te
Electronics Forum | Fri May 14 09:34:18 EDT 2010 | lockj69w
This procedure is from UIC's knowledge base. TO run Diagnostics on AISI 3500 vision. Use of this procedure will require reloading of vision executive once complete. 1. verify PC1 COMM2 is connected to COMM2 on the RADISYS board in slot 1 of VME chass
