Electronics Forum | Fri Mar 29 10:11:02 EDT 2019 | cyber_wolf
“For a number of years now, work has been proceeding in order to bring perfection to the crudely conceived idea of a transmission that would not only supply inverse reactive current for use in unilateral phase detractors, but would also be capable of
Electronics Forum | Thu Aug 19 12:01:26 EDT 2004 | erhard
We want to get a process running to print paste with a thicker plastic stencil with some room left underneath for preassembled components. I know DEK offers these stencils but since we are using an MPM printer they don't want to sell to us stencils f
Electronics Forum | Thu Aug 19 15:49:05 EDT 2004 | pjc
Hi Erhard, Go to http://www.globalstencil.com They are the stencil firm that worked with MPM for developing technology for printing with thick stencils that are milled out on the bottom to account for existing components on the top side of a PC boa
Electronics Forum | Wed Jul 27 09:58:05 EDT 2011 | davef
Pressure printing systems Conventional stencil printing techniques have fundamental limitations as regards paste handling: The volume of paste available for printing is limited, so frequent replenishment is necessary Paste is difficult to c
Electronics Forum | Mon May 07 16:07:05 EDT 2012 | davef
Start with targets based on the stencil thickness (for height) and stencil thickness times the aperture size (for volume). * Set reasonable upper and lower control limits (+ 25% and –25 % of the targets, for example). * Next, check the printer set-u
Electronics Forum | Wed Mar 23 11:08:36 EDT 2011 | davef
There is no such standard, nor should there be. The important thing is to make good solder connections. That's IPC standardization focus, defining good results of manufacturing process. The approach that you take in developing the process of making g
Electronics Forum | Fri Aug 22 00:25:20 EDT 2003 | mantis
Kenny, Out of curisoty why do you need to paste the vias.Is it due to contact reliability at test.Can these vias not be soldered during wave process (if any).Can the Style of probe used in the ICT test fixture not be changed to accomodate these unsol
Electronics Forum | Tue Aug 26 21:12:24 EDT 2003 | iman
depends if your water wash process is manual or automation? important is the water residue inside the via holes is adequately blown out. As long as the water-flux residue is out, testing down the line should not be a issue, at least from theory and o
Electronics Forum | Thu Aug 21 23:35:20 EDT 2003 | kennyg
For ICT purposes I may need to print solder paste on 0.015" test vias. No-clean is not an option for this assembly and OA seems the only choice. Can flux be safely removed from inside the via from the other side during a standard water wash process
Electronics Forum | Thu Jun 21 22:04:18 EDT 2001 | davef
This is my attempt at beating the "Fuzzburg 7" translator used on the SMTnet Forum that mashes everything it sees. Below the next paragraph are three paragraphs,each with a common numering sequence, where each paragraph represents the columns of a t
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