Electronics Forum | Thu Jun 25 18:17:26 EDT 1998 | Earl Moon
| What is the industry standard for calibration compliance certification of SMT machines? and Flow Solder machines? | We are currently doing a Quality Audit on one of our manufacturing venders and this questions has been brought up. | Any help would
Electronics Forum | Thu Jun 25 15:33:51 EDT 1998 | Earl Moon
| | Hi there, | | Does any one know what is TCE for fully wet saturated FR4. I came to know that for Dry FR4 the TCE is about 15-19 PPM �C. Is that true? | | | | Appreciated for your help. | | rgs, | | chiakl | Chiakl, | It looks like you are speaki
Electronics Forum | Wed Jun 03 18:22:19 EDT 1998 | Chrys
| Hello: | BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, op
Electronics Forum | Tue May 26 16:59:47 EDT 1998 | Gary Simbulan
I know, I've read the "been there done that" stories about this subject, but I still profess ignorance on some aspects. We are using NPO type dialectric caps in potted high voltage assemblies and continue to experience catastrophic vailures. Upon
Electronics Forum | Fri May 15 21:09:14 EDT 1998 | Steve Gregory
| | If you have a chance check out the MSD artical (Page 69) in April Electronic Packaging & Production. It is one of the worst articals with unsubstantiated conclusions I have ever seen. Notice Figure 3 on page 72, Caption indicates two simular co
Electronics Forum | Thu Apr 09 14:02:29 EDT 1998 | Earl Moon
| | I am currently involved in a reliability project related to SMT QFP and TSSOP fine pitch solder joint reliability. I have decided to use a temp chamber for stress testing. Is there a test standard that covers this? I am also a bit unsre as to whe
Electronics Forum | Sun Apr 05 09:46:47 EDT 1998 | Earl Moon
| We are looking at reflow soldering some Flexi-rigid | pcbs. I have heard that IR reflow soldering can make the Polyimide "self heat" and cause de-lamination. | Does anyone have any info. The thermal problems associated with polyimide rigid/flex de
Electronics Forum | Mon Mar 02 09:45:08 EST 1998 | Justin Medernach
| Can anyone advise a good starting point for a temp profile for | on 0.05" and 1206 component boards? These boards are simple | by todays standards and do not contain any fine pitch or | other special components. | Thanks in advance... | MM Mike,
Electronics Forum | Mon Mar 02 23:08:50 EST 1998 | Scott McKee
| | Can anyone advise a good starting point for a temp profile for | | on 0.05" and 1206 component boards? These boards are simple | | by todays standards and do not contain any fine pitch or | | other special components. | | Thanks in advance... |
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
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